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74VCX1632245LBR

STMicroelectronics

74VCX1632245LBR by STMicroelectronics

74VCX1632245LBR by STMicroelectronics is a 16-bit bus driver with a propagation delay of just 5.8 ns, supporting voltage translation b/w 1.8V and 3.3V. It features a compact rectangular package and operates in industrial temperatures from -40 °C to 85 °C, ideal for high-speed data applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 8,832 parts In-Stock

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Anansix

USA . 2,015 parts In-Stock

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J2 Sourcing AB

Sweden . 1,862 parts In-Stock

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Chip Stock

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Digiode

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Goldney Electronics S.L.

Spain . 7 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Andel Nordic

Denmark . 5,757 parts In-Stock

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$2.599

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$2.495

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$2.495

5,757

$2.599

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$2.495

Northwest PG Solutions

USA . 1,559 parts In-Stock

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$2.757

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Microchip USA

USA . 220 parts In-Stock

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$7.033

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IDEA Electronic Components Group

UK . 1,722 parts In-Stock

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$11.272

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$10.145

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AZTECH Wire

Italy . 1,170 parts In-Stock

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$14.290

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MKK Technologies

India . 531 parts In-Stock

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DigiPath Technology Company

USA . 531 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,385 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Parana Technologies

USA . 758 parts In-Stock

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Native Components

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Kepictronics

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Perfect Parts

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Overview

Unlock unparalleled performance with the 74VCX1632245LBR from STMicroelectronics! Renowned for its superior quality and reliability, this advanced bus driver and transceiver seamlessly bridges different voltage levels, making it perfect for a wide range of applications. Its exceptional speed and efficiency empower your designs while minimizing power consumption. Choose STMicroelectronics for innovation you can trust, and experience the competitive edge that this versatile component offers in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for various applications.

Propagation Delay At Nominal Supply: 5.8 ns

A low propagation delay enhances the performance of high-speed applications, allowing for quicker data transfer.

Surface Mount: YES

Surface mount capability enables efficient use of PCB space and simplified assembly processes.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, facilitating easier integration into circuit designs.

No. of Bits: 16

With 16 bits, this product allows for wider data pathways, enabling greater throughput in data communication.

Translation: 1.8/2.5V & 3.3V

The ability to translate multiple voltage levels ensures compatibility with various logic families, making it versatile.

Nominal Supply Voltage / Vsup (V): 1.8

The nominal supply voltage of 1.8V is energy-efficient, making it ideal for low-power applications.

Load Capacitance (CL): 30 pF

Low load capacitance allows for faster signal transitions, improving overall circuit performance.

Power Supplies (V): 1.8/2.5, 2.5/3.3

Multiple power supply options enhance flexibility and compatibility with different systems.

No. of Terminals: 54

A higher number of terminals provides greater connectivity options, accommodating complex designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array configuration facilitates efficient heat dissipation and improved signal integrity.

Maximum I (ol): 6 Amp

A high output current capability supports demanding applications, ensuring reliable performance under load.

Propagation Delay (tpd): 6.2 ns

The low propagation delay supports high-speed operations, important for real-time applications.

Maximum Operating Temperature: 85 °C

A high operating temperature range allows for deployment in more demanding environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state outputs enable effective bus management and prevent data collisions, improving communication efficiency.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 85 °C) ensures reliability in extreme conditions, suitable for industrial applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish enhances solderability and corrosion resistance, improving the longevity of connections.

Terminal Position: BOTTOM

Bottom terminal positioning enables effective thermal management through PCB mounting.

No. of Ports: 2

With 2 ports, this device can connect to multiple buses, increasing its application versatility.

Maximum Seated Height: 1.2 mm

A low height profile permits compact designs, making it easier to fit into space-constrained environments.

Width: 5.5 mm

The moderate width provides a balance between density and performance, optimizing layout options.

Output Polarity: TRUE

True output polarity design simplifies integration and ensures predictable circuit behavior.

Minimum Supply Voltage (Vsup): 1.65 V

A low minimum supply voltage broadens the scope of applications and enhances energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The allowable peak reflow time ensures compatibility with various soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for robust soldering without damaging the device.

Length: 8 mm

The compact length contributes to space-saving designs where real estate is crucial.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability for harsh environments and prolonged operational life.

Technology: CMOS

CMOS technology enables low power consumption while maintaining high performance efficiency.

Terminal Form: BALL

Ball terminal form aids in effective thermal and electrical connections, facilitating better performance.

Packing Method: TR

Tape and reel packing method eases automated handling and processing during manufacturing.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch maximizes board density, enabling high levels of integration within compact layouts.

Count Direction: BIDIRECTIONAL

Bidirectional data transfer enhances flexibility and allows for more complex communication protocols.

Control Type: COMMON CONTROL

Common control type simplifies integration and ensures more straightforward designs and implementations.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a reasonable handling requirement, preventing moisture-related damage in assembly.

Maximum Supply Voltage (Vsup): 2.7 V

A maximum supply voltage of 2.7V provides flexibility for integration in various voltage environments.

Technical Specifications

Bus Driver & Transceivers 74VCX1632245LBR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5,2.5/3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/2.5V&3.3V

Width:

5.5 mm

Trade Compliance

74VCX1632245LBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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