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74VCX16245TTR

STMicroelectronics

74VCX16245TTR by STMicroelectronics

74VCX16245TTR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3.4 ns, supporting bidirectional data flow. It operates b/w 1.8V and 3.6V, making it ideal for low-power applications. With a compact SO package and military-grade temperature range (-55 °C to 125°C), it's perfect for demanding environments.

Median Price

$0.738

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Sense

UK . 3,176 parts In-Stock

1+ parts

-

100+ parts

$0.738

1k+ parts

$0.500

10k+ parts

$0.500

3,176

-

$0.738

$0.500

$0.500

Vyrian

USA . 2,075 parts In-Stock

1+ parts

-

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-

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2,075

-

-

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Digiode

USA . 1,978 parts In-Stock

1+ parts

-

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-

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1,978

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Anansix

USA . 499 parts In-Stock

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499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 329 parts In-Stock

1+ parts

$2.045

100+ parts

-

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-

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329

$2.045

-

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Northwest PG Solutions

USA . 521 parts In-Stock

1+ parts

$2.250

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-

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-

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-

521

$2.250

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Andel Nordic

Denmark . 2,217 parts In-Stock

1+ parts

$3.039

100+ parts

-

1k+ parts

$2.917

10k+ parts

$2.917

2,217

$3.039

-

$2.917

$2.917

AZTECH Wire

Italy . 467 parts In-Stock

1+ parts

$11.400

100+ parts

-

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-

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-

467

$11.400

-

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

1+ parts

$30.992

100+ parts

-

1k+ parts

$27.893

10k+ parts

-

2,028

$30.992

-

$27.893

-

MKK Technologies

India . 542 parts In-Stock

1+ parts

$58.279

100+ parts

-

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542

$58.279

-

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DigiPath Technology Company

USA . 542 parts In-Stock

1+ parts

$58.279

100+ parts

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542

$58.279

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Perfect Parts

USA . 7,468 parts In-Stock

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7,468

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Microchip USA

USA . 5,629 parts In-Stock

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5,629

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Parana Technologies

USA . 2,172 parts In-Stock

1+ parts

-

100+ parts

$37.056

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2,172

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$37.056

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Corphita

USA . 832 parts In-Stock

1+ parts

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832

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Overview

Elevate your designs with the 74VCX16245TTR from STMicroelectronics—a trusted leader in high-quality semiconductor solutions. This advanced bus driver and transceiver ensures rapid data transfer with unmatched reliability, making it ideal for automotive, industrial, and telecommunications applications. Its compact design and efficient power consumption reduce space and enhance performance, delivering exceptional value to your projects while meeting rigorous standards. Unlock new possibilities with ST's renowned innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability in various environmental conditions, making it suitable for a range of applications.

Propagation Delay At Nominal Supply: 3.4 ns

A low propagation delay of 3.4 ns allows for faster data transmission, enhancing overall system performance.

Surface Mount: YES

Surface mount technology contributes to a smaller footprint and enables automated assembly, reducing production costs.

No. of Functions: 2

With two functions integrated into one chip, this product optimizes space and can simplify circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into PCB layouts, ensuring efficient use of space.

No. of Bits: 8

An 8-bit configuration allows for sufficient data handling capabilities for many applications, making it versatile.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5 V helps to reduce power consumption while maintaining performance.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF supports stable operation and is adaptable to a variety of circuit configurations.

Power Supplies (V): 3.3

Compatibility with 3.3 V power supplies makes this device ideal for modern digital applications.

No. of Terminals: 48

Having 48 terminals offers numerous connections, making it suitable for complex circuitry.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile help save space on PCBs, allowing for more compact designs.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amp, this product can drive substantial loads, enhancing its applicability.

Propagation Delay (tpd): 7 ns

A propagation delay of 7 ns ensures efficient signal integrity at higher speeds, critical for high-performance applications.

Maximum Operating Temperature: 125 °C

The ability to operate at a maximum temperature of 125 °C makes this device suitable for high-temperature environments.

Output Characteristics: 3-STATE

The 3-state output characteristic enhances flexibility in design, allowing for better management of multi-device systems.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures reliability in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and corrosion resistance, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning offers versatile mounting options, facilitating easier integration into various designs.

No. of Ports: 2

The presence of two ports allows for increased channel utilization, making it ideal for applications requiring data exchange.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm enables fitting into compact designs and low-profile applications.

Width: 6.1 mm

A width of 6.1 mm contributes to efficient PCB layout, helping optimize space without sacrificing functionality.

Output Polarity: TRUE

The true output polarity simplifies the design and caters to standard logic levels used in many digital circuits.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8 V allows for greater flexibility in power supply choices, aiding compatibility with various systems.

Length: 12.5 mm

With a length of 12.5 mm, this component is compact yet provides all necessary functionality for high-density applications.

Temperature Grade: MILITARY

The military-grade temperature rating underscores reliability and performance in demanding applications.

Technology: CMOS

Using CMOS technology ensures low power consumption alongside high performance, ideal for energy-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent soldering reliability, ensuring strong connections on the PCB.

Packing Method: TR

The TR packing method facilitates easy handling and efficient use in manufacturing processes.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density integration, making it suitable for compact electronic designs.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability enhances the versatility of the device in various applications, particularly in communication protocols.

Control Type: COMMON CONTROL

A common control type simplifies operational controls, making design and functionality more intuitive.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of devices, making it a flexible option for various applications.

Technical Specifications

Bus Driver & Transceivers 74VCX16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.4 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74VCX16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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