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74V2G66CTR

STMicroelectronics

74V2G66CTR by STMicroelectronics

74V2G66CTR by STMicroelectronics is a dual SPST CMOS switch with a max supply voltage of 5.5 V and operates b/w -55 °C to 125°C. It features low on-state resistance (19 Ω) and fast switching times (4 ns on, 7.5 ns off). Ideal for compact applications in military electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,702 parts In-Stock

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4,702

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Digiode

USA . 4,656 parts In-Stock

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4,656

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Anansix

USA . 2,059 parts In-Stock

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2,059

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Distributors (Availability)

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Native Components

USA . 255 parts In-Stock

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$7.208

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255

$7.208

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IDEA Electronic Components Group

UK . 461 parts In-Stock

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$9.214

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$8.292

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461

$9.214

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$8.292

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MKK Technologies

India . 2,332 parts In-Stock

1+ parts

$17.326

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2,332

$17.326

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DigiPath Technology Company

USA . 2,332 parts In-Stock

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$17.326

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2,332

$17.326

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Corphita

USA . 4,535 parts In-Stock

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4,535

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Parana Technologies

USA . 2,085 parts In-Stock

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$11.016

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2,085

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$11.016

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Northwest PG Solutions

USA . 187 parts In-Stock

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$7.064

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187

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$7.064

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Overview

Unlock the potential of your designs with the 74V2G66CTR from STMicroelectronics, a trusted name in semiconductor innovation. This high-performance multiplexer offers remarkable reliability and efficiency for diverse applications, from industrial control systems to telecommunications. Its compact, thin-profile design ensures seamless integration into your projects, while superior temperature tolerance guarantees lasting performance. Elevate your solutions with unmatched quality and precision—choose STMicroelectronics for excellence that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability, moisture resistance, and reliable performance.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern PCB layouts.

No. of Functions: 2

Having two functions allows for versatile applications, enabling multiple switching operations in a single package.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient, making it suitable for high-density applications.

Nominal Supply Voltage (Vsup): 3.3 V

Designed for low-voltage operation, making it ideal for power-sensitive applications in modern electronics.

No. of Terminals: 8

An 8-terminal configuration supports various circuit designs and enhances connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style accommodates tight spaces and improves manufacturing efficiencies.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures stable performance in demanding environments.

Minimum Operating Temperature: -55 °C

The wide temperature range enables operation in extreme conditions, suitable for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier soldering and enhances layout flexibility on PCBs.

Maximum Seated Height: 1.1 mm

The low seated height contributes to the compactness of the device, allowing for slimmer designs.

Width: 1.25 mm

Narrow width enhances space efficiency on PCBs, enabling integration into tightly packed layouts.

Other IC type: SPST

Single Pole Single Throw functionality provides straightforward switching capabilities suitable for various applications.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage enhances battery life in portable devices and reduces power consumption.

Maximum On-state Resistance (Ron): 19 ohm

A low on-state resistance minimizes power loss and ensures efficient signal transmission.

Maximum Switch-on Time: 4 ns

Fast switch-on time makes this product ideal for high-speed applications where quick response is critical.

Length: 2 mm

Compact length allows designers to optimize layouts for smaller devices, contributing to overall product miniaturization.

Maximum Switch-off Time: 7.5 ns

Quick switch-off time enhances performance in fast-paced signal environments, reducing delay.

Temperature Grade: MILITARY

MILITARY-grade specifications ensure reliability and robustness in challenging conditions, ideal for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, essential for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering properties and mechanical stability, ensuring robust connections.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for greater density on PCB designs, making it suitable for miniaturized applications.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible maximum supply voltage range accommodates various circuit designs, making it adaptable for different applications.

Technical Specifications

Multiplexers & Switches 74V2G66CTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Maximum On-state Resistance (Ron):

19 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

7.5 ns

Maximum Switch-on Time:

4 ns

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

1.25 mm

Trade Compliance

74V2G66CTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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