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74V2T66CTR

STMicroelectronics

74V2T66CTR by STMicroelectronics

74V2T66CTR by STMicroelectronics is a CMOS SPST switch with a max on-state resistance of 17Ω and operates b/w -55 °C to 125°C. It features dual functions in an 8-terminal, thin-profile package. Ideal for military applications requiring reliable performance at low power.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,062 parts In-Stock

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Anansix

USA . 2,000 parts In-Stock

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Vyrian

USA . 187 parts In-Stock

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IDEA Electronic Components Group

UK . 158 parts In-Stock

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$5.974

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$5.376

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MKK Technologies

India . 728 parts In-Stock

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$11.233

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DigiPath Technology Company

USA . 728 parts In-Stock

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$11.233

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Northwest PG Solutions

USA . 1,655 parts In-Stock

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Corphita

USA . 877 parts In-Stock

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Parana Technologies

USA . 797 parts In-Stock

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$7.142

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Native Components

USA . 603 parts In-Stock

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Overview

Unlock unparalleled performance with the 74V2T66CTR from STMicroelectronics, a leader in innovation and reliability. This versatile multiplexer is designed for efficiency, delivering superior speed and low power consumption, making it ideal for a wide range of applications—from telecommunications to industrial controls. With its robust temperature tolerance and compact design, you gain both flexibility and durability in your projects, ensuring they run smoothly and efficiently under any conditions. Experience the difference with STMicroelectronics, where quality meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials offers good durability and protection against environmental factors, making this product reliable for diverse applications.

Surface Mount: YES

Surface mount technology ensures a compact design suitable for high-density circuit boards, thus facilitating miniaturization of electronic devices.

No. of Functions: 2

Having two functions allows for versatile applications, enabling users to implement more complex designs without needing additional components.

Package Shape: RECTANGULAR

The rectangular package shape aids in space-efficient arrangements on PCBs, enhancing design flexibility.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard in many applications, ensuring compatibility with a wide range of electronic systems.

Power Supplies (V): 5

The specified power supply voltage further confirms the suitability of this multiplexer for typical digital circuits.

No. of Terminals: 8

With 8 terminals, this device can connect to several signal paths, making it ideal for complex switching applications.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch make it highly suitable for use in compact electronic devices without compromising functionality.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C ensures reliability in demanding environments, making this product suitable for industrial applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows for use in extreme conditions, proving it to be robust for challenging applications.

Terminal Position: DUAL

Dual terminal positioning facilitates ease of use and better layout options on circuit boards.

Maximum Seated Height: 1.1 mm

The low seated height optimizes space on the PCB, enabling high-density designs.

Width: 1.25 mm

A narrow width contributes to the compactness of the component, allowing more room for other parts on the PCB.

Other IC type: SPST

As a Single Pole Single Throw (SPST) type, it provides simple switching capabilities that are easy to implement in designs.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate down to 4.5V allows for flexibility in power supply variations, making it adaptable to various systems.

Maximum On-state Resistance (Ron): 17 ohm

A low on-state resistance ensures minimal signal loss during operation, enhancing overall circuit performance.

Maximum Switch-on Time: 4 ns

Fast switch-on time enables high-speed applications, ensuring efficient performance in high-frequency circuits.

Maximum Switch-off Time: 7.5 ns

A quick switch-off time supports high-speed operation, making it suitable for advanced digital applications.

Temperature Grade: MILITARY

A military temperature grade indicates superior quality and reliability for use in rigorous environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it advantageous for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals improve soldering reliability and ease of assembly in automated processes, promoting higher manufacturing yield.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is optimal for high-density PCB designs, allowing for more components to fit in a smaller area.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides some margin for transient conditions, ensuring stable performance.

Nominal Off-state Isolation: 60 dB

High off-state isolation minimizes crosstalk between channels, enhancing signal integrity and overall circuit performance.

Technical Specifications

Multiplexers & Switches 74V2T66CTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

60 dB

Maximum On-state Resistance (Ron):

17 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

7.5 ns

Maximum Switch-on Time:

4 ns

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

1.25 mm

Trade Compliance

74V2T66CTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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