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74V2T66STR

STMicroelectronics

74V2T66STR by STMicroelectronics

74V2T66STR by STMicroelectronics is a dual SPST switch with a max on-state resistance of 17Ω and operates b/w -55 °C to 125°C. It features a compact SOIC package, ideal for low-profile applications. Designed for military use, it supports supply voltages from 4.5V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,989 parts In-Stock

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4,989

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Vyrian

USA . 3,834 parts In-Stock

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3,834

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Anansix

USA . 539 parts In-Stock

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539

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,051 parts In-Stock

1+ parts

$7.495

100+ parts

-

1k+ parts

$6.746

10k+ parts

-

1,051

$7.495

-

$6.746

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AZTECH Wire

Italy . 733 parts In-Stock

1+ parts

$8.690

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-

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733

$8.690

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Microchip USA

USA . 405 parts In-Stock

1+ parts

$9.174

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405

$9.174

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Native Components

USA . 202 parts In-Stock

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$10.550

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202

$10.550

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Northwest PG Solutions

USA . 1,921 parts In-Stock

1+ parts

$11.605

100+ parts

$10.445

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1,921

$11.605

$10.445

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MKK Technologies

India . 963 parts In-Stock

1+ parts

$14.094

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963

$14.094

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DigiPath Technology Company

USA . 963 parts In-Stock

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$14.094

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963

$14.094

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Component Stockers USA

USA . 761 parts In-Stock

1+ parts

$99.990

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761

$99.990

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Corphita

USA . 1,175 parts In-Stock

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1,175

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Parana Technologies

USA . 722 parts In-Stock

1+ parts

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100+ parts

$8.962

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722

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$8.962

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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$8.142

1k+ parts

$7.539

10k+ parts

$7.539

100

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$8.142

$7.539

$7.539

Overview

Unlock the power of precision with the 74V2T66STR from STMicroelectronics, a top-tier choice in multiplexers and switches. Crafted with military-grade durability, this low-profile solution excels in demanding applications, ensuring reliable performance even in extreme conditions. Enjoy reduced power consumption and lightning-fast switching speeds that enhance your designs, making it ideal for telecommunications, automotive, and industrial sectors. Experience unmatched quality and innovation with STMicroelectronics as your trusted partner!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliable performance and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into PCB layouts, making this product ideal for space-constrained applications.

No. of Functions: 2

The dual functionality provides flexibility for various applications, allowing the design of more versatile circuits with fewer components.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for space-efficient layouts, facilitating easier placement on printed circuit boards.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5 V, this product is well-suited for standard digital logic applications, aligning with common system specifications.

Power Supplies (V): 5

Operating at a common supply voltage simplifies the design and integration process, reducing the need for additional voltage regulation.

No. of Terminals: 8

The 8 terminals provide multiple connectivity options, enhancing the product's versatility in handling different signal routings.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low profile design minimizes space requirements on PCBs, enabling denser circuit layouts and improving overall device compactness.

Maximum Operating Temperature: 125 °C

Designed to operate up to 125 °C, this product ensures reliable functionality in high-temperature environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -55 °C

The ability to function down to -55 °C guarantees performance in extreme cold conditions, ideal for aerospace and military uses.

Terminal Position: DUAL

Dual terminal positioning allows for enhanced layout flexibility and easier soldering on the PCB.

Maximum Seated Height: 1.45 mm

With a low seated height, this product is excellent for applications requiring slim profiles and compact design.

Width (mm): 1.625 mm

Narrow width aids in compact designs, allowing for efficient use of available board space.

Other IC type: SPST

As a Single Pole Single Throw (SPST) switch, it provides basic controlling functionality with straightforward operation.

Minimum Supply Voltage (Vsup): 4.5 V

Operating down to 4.5 V allows for flexible power management in various circuit designs with potential for battery-powered applications.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures ensures compatibility with standard soldering processes used in PCB assembly.

Maximum On-state Resistance (Ron): 17 ohm

A low on-state resistance minimizes power losses and heat generation, improving overall energy efficiency in the circuit.

Maximum Switch-on Time: 4 ns

Fast switching times enable high-speed applications, making this product suitable for high-frequency signal routing.

Length: 2.9 mm

Short length aids in compact arrangements, allowing for integration into small electronics.

Maximum Switch-off Time: 7.5 ns

Swift switch-off times enhance system responsiveness, crucial for high-speed data transmission and signal integrity.

Temperature Grade: MILITARY

Built to military specifications ensures high reliability under extreme conditions, suitable for defense and critical applications.

Technology: CMOS

Using CMOS technology allows for low power consumption, making this product efficient for battery-powered and performance-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal design facilitates easy soldering and improves mechanical stability on PCBs.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch provides a balance between compactness and ease of handling during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of handling a slightly higher supply voltage provides flexibility for various designs that may require higher voltage levels.

Nominal Off-state Isolation: 60 dB

High off-state isolation ensures minimal signal leakage, enhancing performance in applications requiring signal integrity.

Technical Specifications

Multiplexers & Switches 74V2T66STR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

60 dB

Maximum On-state Resistance (Ron):

17 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

7.5 ns

Maximum Switch-on Time:

4 ns

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

1.625 mm

Trade Compliance

74V2T66STR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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