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74LVXU04TTR

STMicroelectronics

74LVXU04TTR by STMicroelectronics

74LVXU04TTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 13 ns and operates b/w 2-3.6 V. It features six functions in a compact 14-terminal package, ideal for high-speed applications in military environments. Its robust design supports temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,919 parts In-Stock

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Digiode

USA . 1,043 parts In-Stock

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Anansix

USA . 721 parts In-Stock

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721

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Microchip USA

USA . 342 parts In-Stock

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$9.793

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342

$9.793

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IDEA Electronic Components Group

UK . 1,308 parts In-Stock

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$16.963

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$15.267

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$16.963

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$15.267

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AZTECH Wire

Italy . 1,143 parts In-Stock

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$21.460

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$21.460

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MKK Technologies

India . 888 parts In-Stock

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$31.898

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$31.898

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DigiPath Technology Company

USA . 888 parts In-Stock

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$31.898

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$31.898

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Native Components

USA . 33 parts In-Stock

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$36.750

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$35.280

33

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$35.280

Northwest PG Solutions

USA . 1,283 parts In-Stock

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$40.425

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$40.425

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A-Z Elektronik GmbH

Germany . 7,421 parts In-Stock

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Perfect Parts

USA . 4,941 parts In-Stock

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RC Electronics

USA . 2,961 parts In-Stock

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Parana Technologies

USA . 1,428 parts In-Stock

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Corphita

USA . 466 parts In-Stock

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Overview

Unlock unparalleled performance with the 74LVXU04TTR from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for precision and reliability, this logic gate offers exceptional speed and efficiency, making it perfect for applications across automotive, industrial, and consumer electronics. With its compact design and robust operating range, you can trust the 74LVXU04TTR to enhance your projects while delivering outstanding value and performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 13 ns

A fast propagation delay ensures quicker switching times, making the device suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design, enabling high-density PCB layouts.

No. of Functions: 6

Multiple functions in one package provide versatility, ideal for complex designs with space limitations.

Package Shape: RECTANGULAR

The rectangular shape maximizes layout flexibility and contributes to efficient use of board space.

Nominal Supply Voltage / Vsup: 2.7 V

Operating at a low nominal voltage reduces power consumption, which is crucial for battery-operated devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for reliable operation in conjunction with a range of load conditions.

Power Supplies (V): 3.3 V

Designed to work with standard power supply voltages, making it compatible with most systems.

No. of Terminals: 14

A 14-terminal setup offers ample connection options for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline facilitate easy integration into space-constrained applications.

Maximum I (ol): 4 Amp

Supporting up to 4 Amps of output current provides the ability to drive larger loads effectively.

Propagation Delay (tpd): 15.2 ns

With a low propagation delay, the product is suitable for high-frequency applications, improving overall system performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in demanding thermal environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for usage in extreme conditions, enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish ensures good conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB design and improves layout efficiency.

Maximum Seated Height: 1.2 mm

Low seated height allows for a slimmer design, contributing to space-saving in compact electronic devices.

Width: 4.4 mm

A narrow width provides better flexibility in board design, making it easier to fit into smaller spaces.

Minimum Supply Voltage (Vsup): 2 V

Ability to operate at a minimum voltage of 2 V enhances compatibility with low-power systems.

Length: 5 mm

Short length promotes compact design and efficient space utilization in PCB designs.

Temperature Grade: MILITARY

Military-grade classification ensures high reliability and performance in harsh conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for modern applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and automated assembly processes, improving production efficiency.

Packing Method: TR

Tape and reel packaging enables automated pick and place assembly, benefiting high-volume production.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for finer pitch designs, accommodating smaller and more complex circuit layouts.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for flexibility in applications that require higher voltage levels.

Technical Specifications

Logic Gates 74LVXU04TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

15.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVXU04TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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