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74LVXU04MTR

STMicroelectronics

74LVXU04MTR by STMicroelectronics

74LVXU04MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 13 ns and operates at a supply voltage of 2.7-3.6 V. It features six functions in a compact 14-terminal package, ideal for high-speed applications in military environments. Its robust design supports temperatures from -55 °C to 125 °C, ensuring reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,818 parts In-Stock

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Anansix

USA . 2,505 parts In-Stock

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Vyrian

USA . 2,229 parts In-Stock

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Andel Nordic

Denmark . 815 parts In-Stock

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$8.107

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-

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$7.783

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$7.783

815

$8.107

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$7.783

$7.783

AZTECH Wire

Italy . 730 parts In-Stock

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$20.830

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730

$20.830

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IDEA Electronic Components Group

UK . 1,914 parts In-Stock

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$27.887

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$25.098

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1,914

$27.887

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$25.098

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Microchip USA

USA . 181 parts In-Stock

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$40.498

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181

$40.498

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MKK Technologies

India . 238 parts In-Stock

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$52.440

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238

$52.440

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DigiPath Technology Company

USA . 238 parts In-Stock

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$52.440

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Corphita

USA . 2,580 parts In-Stock

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2,580

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Parana Technologies

USA . 2,154 parts In-Stock

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$33.343

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$33.343

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Northwest PG Solutions

USA . 1,814 parts In-Stock

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Native Components

USA . 681 parts In-Stock

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Overview

Unlock the potential of your designs with the 74LVXU04MTR from STMicroelectronics—a trusted leader in innovative semiconductor solutions. This versatile logic gate delivers exceptional performance with low power consumption, making it ideal for a broad range of applications from consumer electronics to industrial automation. Experience reliability and precision engineered to meet military-grade standards, ensuring durability in challenging environments. Elevate your projects with unmatched quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 13 ns

A low propagation delay allows for faster switching speeds, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Being surface mount technology (SMT) makes installation easier and allows for a more compact PCB design.

No. of Functions: 6

With 6 functions available, this product offers versatility in logic operations for complex circuit designs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCB layouts.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7 V is suitable for modern low-voltage applications, enhancing power efficiency.

Load Capacitance (CL): 50 pF

A low load capacitance enhances the switching performance, making it ideal for high-speed digital circuits.

Power Supplies (V): 3.3

Operating at 3.3 V aligns with common standards in digital electronics, making it easy to integrate into existing systems.

No. of Terminals: 14

The 14 terminals provide ample connectivity options for various circuits, ensuring flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package saves PCB space and is ideal for compact electronic devices.

Maximum I (ol): 4 Amp

The capability to handle up to 4 Amps ensures robust performance under load, suitable for high-current applications.

Propagation Delay (tpd): 15.2 ns

The propagation delay of 15.2 ns is competitive, helping maintain signal integrity in high-speed operations.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating allows this product to function efficiently in extreme environments.

Minimum Operating Temperature: -55 °C

The product can operate in very low temperatures, making it suitable for harsh conditions in military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances solderability and longevity, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning enables flexible routing options on PCBs, facilitating better design versatility.

Maximum Seated Height: 1.75 mm

A compact seated height aids in space optimization on PCBs, particularly beneficial in miniaturized electronics.

Width: 3.9 mm

A narrow width supports denser layouts, making it ideal for compact electronic devices.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum of 2 V enhances flexibility in power supply options for various applications.

Maximum Time At Peak Reflow Temperature (s): 40

The 40 seconds time at peak reflow temperature supports robust soldering processes during assembly, enhancing reliability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand standard soldering processes, ensuring high-quality manufacturing.

Length: 8.65 mm

The length is suitable for a variety of applications, offering a balance between size and functionality.

Temperature Grade: MILITARY

The military-grade temperature rating guarantees performance under extreme conditions, making it ideal for defense applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing overall circuit efficiency.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are easier to solder, ensuring robust connections.

Packing Method: TR

The tape and reel packing method facilitates automated assembly processes, enhancing production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances compact design with manufacturability, suitable for high-density PCBs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V provides ample headroom for performance while ensuring operational safety.

Technical Specifications

Logic Gates 74LVXU04MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

15.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVXU04MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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