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74LVX4245TTR

STMicroelectronics

74LVX4245TTR by STMicroelectronics

74LVX4245TTR by STMicroelectronics is an 8-bit bus driver/transceiver with a propagation delay of just 9 ns, supporting both 3V and 5V translation. It features a compact SO package and operates in extreme temperatures from -55 °C to 125°C. Ideal for military applications, it ensures reliable data transfer with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,223 parts In-Stock

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7,223

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Digiode

USA . 4,542 parts In-Stock

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4,542

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Anansix

USA . 802 parts In-Stock

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802

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 13 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

$0.038

13

$0.039

-

-

$0.038

Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$7.931

100+ parts

-

1k+ parts

$7.613

10k+ parts

$7.613

50

$7.931

-

$7.613

$7.613

AZTECH Wire

Italy . 132 parts In-Stock

1+ parts

$18.990

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-

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132

$18.990

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$21.385

100+ parts

$19.460

1k+ parts

$17.536

10k+ parts

-

2,500

$21.385

$19.460

$17.536

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IDEA Electronic Components Group

UK . 441 parts In-Stock

1+ parts

$22.764

100+ parts

-

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$20.488

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-

441

$22.764

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$20.488

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MKK Technologies

India . 519 parts In-Stock

1+ parts

$42.807

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519

$42.807

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DigiPath Technology Company

USA . 519 parts In-Stock

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$42.807

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519

$42.807

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QUARKTWIN TECHNOLOGY LTD

USA . 25,071 parts In-Stock

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25,071

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Microchip USA

USA . 3,802 parts In-Stock

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3,802

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Northwest PG Solutions

USA . 2,346 parts In-Stock

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2,346

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Corphita

USA . 2,092 parts In-Stock

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2,092

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Kepictronics

USA . 720 parts In-Stock

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720

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Parana Technologies

USA . 712 parts In-Stock

1+ parts

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$27.218

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712

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$27.218

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Overview

Elevate your designs with the 74LVX4245TTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust bus driver and transceiver excels in bridging 3V and 5V systems, ensuring seamless communication across applications like telecom, automotive, and industrial control. With its fast propagation delay and compact footprint, it promises reliability without compromising on space. Experience superior performance and elevate your projects with this quality component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and longevity, making it suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay enhances speed in data transmission, improving overall system performance.

Surface Mount: YES

Surface mount capability allows for compact designs and simpler assembly processes.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and design flexibility.

No. of Bits: 8

An 8-bit design allows for handling a wide range of data, suitable for various applications.

Translation: 3V & 5V

Supports both 3V and 5V interfaces, making it versatile for different systems.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V enables energy-efficient operation.

Power Supplies (V): 3.3, 5

Compatible with common power supply levels, promoting easier integration into existing systems.

No. of Terminals: 24

With 24 terminals, this device offers extensive connectivity options for diverse applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for space-constrained designs.

Maximum I (ol): 24 Amp

A high current rating supports robust performance in demanding applications.

Propagation Delay (tpd): 11 ns

An additional propagation delay measure reassures about optimal speed for data handling.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, suitable for harsh environments and industrial applications.

Output Characteristics: 3-STATE

3-state output allows for simple bus management, enhancing system design versatility.

Minimum Operating Temperature: -55 °C

Extreme temperature ratings make it reliable for use in challenging conditions.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and resistance to oxidation.

Terminal Position: DUAL

Dual terminal position supports various PCB layouts, enhancing design flexibility.

No. of Ports: 2

Having two ports allows for multiple communication lines, increasing functionality.

Maximum Seated Height: 1.1 mm

Low seated height is suitable for compact electronic designs, saving space.

Width: 4.4 mm

The narrow width helps in fitting into tight spaces, making it ideal for miniaturization.

Output Polarity: TRUE

True output polarity contributes to straightforward integration in standard circuits.

Minimum Supply Voltage (Vsup): 2.7 V

Operational at lower voltages enhances power efficiency, particularly for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

Tolerates extended peak reflow time, making it suitable for modern manufacturing processes.

Peak Reflow Temperature (°C): 260

High peak reflow temperature compatibility allows for robust soldering processes.

Length: 7.8 mm

Compact length enhances versatility in various PCB layouts and designs.

Temperature Grade: MILITARY

Meets military specifications, ensuring durability and reliability under extreme conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical stability and ease of soldering.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes.

Terminal Pitch: 0.65 mm

A fine terminal pitch supports dense PCB layouts, maximizing space efficiency.

Count Direction: BIDIRECTIONAL

Bidirectional counting enhances the flexibility of bus communication in various applications.

Control Type: COMMON CONTROL

Common control makes the device simpler to integrate into existing systems.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates appropriate handling procedures, ensuring product reliability and longevity.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a wide supply voltage range, making it adaptable for various circuit designs.

Technical Specifications

Bus Driver & Transceivers 74LVX4245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

PORT A OPERATES AT 4.5V TO 5.5V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

4.4 mm

Trade Compliance

74LVX4245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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