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74LVX374MTR

STMicroelectronics

74LVX374MTR by STMicroelectronics

74LVX374MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 17 ns, operating at a supply voltage of 2.7-3.6 V. It features a compact SO package and supports high-speed applications up to 50 MHz. Ideal for military-grade electronics, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,801 parts In-Stock

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5,801

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Digiode

USA . 4,614 parts In-Stock

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4,614

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Anansix

USA . 660 parts In-Stock

1+ parts

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660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 984 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

-

10k+ parts

$0.065

984

$0.068

-

-

$0.065

Northwest PG Solutions

USA . 66 parts In-Stock

1+ parts

$0.074

100+ parts

-

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-

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$0.065

66

$0.074

-

-

$0.065

Andel Nordic

Denmark . 235 parts In-Stock

1+ parts

$7.182

100+ parts

-

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$6.895

10k+ parts

$6.895

235

$7.182

-

$6.895

$6.895

AZTECH Wire

Italy . 1,129 parts In-Stock

1+ parts

$20.480

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-

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1,129

$20.480

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IDEA Electronic Components Group

UK . 1,531 parts In-Stock

1+ parts

$21.538

100+ parts

-

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$19.384

10k+ parts

-

1,531

$21.538

-

$19.384

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MKK Technologies

India . 1,295 parts In-Stock

1+ parts

$40.501

100+ parts

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1,295

$40.501

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DigiPath Technology Company

USA . 1,295 parts In-Stock

1+ parts

$40.501

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1,295

$40.501

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QUARKTWIN TECHNOLOGY LTD

USA . 12,629 parts In-Stock

1+ parts

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12,629

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Microchip USA

USA . 3,597 parts In-Stock

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3,597

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Parana Technologies

USA . 1,463 parts In-Stock

1+ parts

-

100+ parts

$25.752

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1,463

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$25.752

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

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900

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Corphita

USA . 567 parts In-Stock

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567

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Overview

Unlock superior connectivity with the 74LVX374MTR from STMicroelectronics—a trusted leader in innovation and quality. This 8-bit bus driver ensures optimal performance with low power consumption, making it ideal for a range of applications from industrial controls to consumer electronics. With its robust design and reliable operating temperature, you can depend on this component to elevate your projects while minimizing delays. Choose STMicroelectronics for unmatched reliability and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and protection against environmental factors, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 17 ns

A short propagation delay enhances the device's performance in fast digital circuits, ensuring efficient signal transmission.

Surface Mount: YES

Surface mount capability allows for compact PCB design and easier integration into modern electronics.

Package Shape: RECTANGULAR

The rectangular shape provides a stable layout for mounting and effective space utilization on the circuit board.

No. of Bits: 8

An 8-bit data width is ideal for a variety of applications, allowing for sufficient data handling capabilities.

Nominal Supply Voltage / Vsup (V): 2.7

Works efficiently at a nominal voltage, ensuring optimal performance with reduced power consumption.

Load Capacitance (CL): 50 pF

A moderate load capacitance supports faster data rates and enhances the overall performance in high-speed applications.

Power Supplies (V): 3.3

Utilizes a common power supply level of 3.3V, facilitating easy integration into most electronic systems.

No. of Terminals: 20

A sufficient number of terminals allows for versatile connectivity options in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline design maximizes board space and enables high-density mounting of components.

Maximum I (ol): 4 Amp

Capable of handling up to 4 Amps of output current, making it suitable for driving various loads.

Propagation Delay (tpd): 24 ns

This propagation delay is suitable for reliable performance in high-speed applications, maintaining accurate signaling.

Maximum Operating Temperature: 125 °C

Designed to operate in high-temperature environments, increasing reliability and performance in demanding applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus-related applications, allowing multiple devices to share a communication line.

Trigger Type: POSITIVE EDGE

The positive edge trigger design ensures synchronized operation with modern digital systems.

Minimum Operating Temperature: -55 °C

This wide temperature range ensures functionality in extreme environments, making this product suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The advanced terminal finish enhances solderability and ensures long-term reliability of electrical connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in layout design and ease of handling during assembly.

No. of Ports: 2

Having two ports allows for dual communication channels, enhancing the versatility of applications.

Maximum Seated Height: 2.65 mm

A low seated height minimizes PCB space usage while still providing robust performance.

Width: 7.5 mm

A compact width allows for efficient placement in space-constrained designs.

Output Polarity: TRUE

True output polarity simplifies interfacing with standard logic levels, ensuring compatibility and ease of integration.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum of 2V provides flexibility and energy efficiency in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures the device can withstand the manufacturing process without damaging the component.

Peak Reflow Temperature °C: 260

A high peak reflow temperature capability allows for reliable soldering without compromising component integrity.

Length: 12.8 mm

The length is optimized for space efficiency, making it suitable for compact electronic designs.

Temperature Grade: MILITARY

MIL-STD rating ensures reliability and performance in critical applications such as defense and aerospace.

Maximum Frequency At Nominal Supply: 50000000 Hz

Supports high-speed data rates, making it suitable for demanding applications like data communications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, essential for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical stability and ease of soldering during assembly.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm enhances compatibility with various PCBs and assembly equipment.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate level of sensitivity to moisture, allowing for reasonable storage and handling protocols.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of modern electronic devices.

Technical Specifications

Bus Driver & Transceivers 74LVX374MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

50000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

74LVX374MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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