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74LVX3245TTR

STMicroelectronics

74LVX3245TTR by STMicroelectronics

74LVX3245TTR by STMicroelectronics is a CMOS bus driver & transceiver with 8 bits of translation b/w 3V and 5V. It has a propagation delay of 9 ns, operates at a nominal voltage of 3V, and can handle max operating temperatures up to 125°C. This component is commonly used in military-grade applications requiring bidirectional control and common control features.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,360 parts In-Stock

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4,360

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Vyrian

USA . 3,788 parts In-Stock

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3,788

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VNN

France . 2,306 parts In-Stock

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2,306

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Anansix

USA . 1,817 parts In-Stock

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1,817

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,078 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

-

1,078

$4.000

$3.900

$3.880

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Andel Nordic

Denmark . 23 parts In-Stock

1+ parts

$7.634

100+ parts

-

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$7.328

10k+ parts

$7.328

23

$7.634

-

$7.328

$7.328

AZTECH Wire

Italy . 720 parts In-Stock

1+ parts

$9.529

100+ parts

-

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720

$9.529

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Microchip USA

USA . 482 parts In-Stock

1+ parts

$9.874

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482

$9.874

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IDEA Electronic Components Group

UK . 1,275 parts In-Stock

1+ parts

$10.872

100+ parts

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$9.784

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1,275

$10.872

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$9.784

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Corohmni

South Africa . 193 parts In-Stock

1+ parts

$17.483

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193

$17.483

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Aztec Data Supply Inc.

USA . 3,579 parts In-Stock

1+ parts

$20.410

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3,579

$20.410

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MKK Technologies

India . 615 parts In-Stock

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$20.443

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615

$20.443

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DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$20.443

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615

$20.443

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Ampacity Inc.

Singapore . 1,557 parts In-Stock

1+ parts

$40.000

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1,557

$40.000

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Continental Prestige Electronics

USA . 5,142 parts In-Stock

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Corphita

USA . 2,965 parts In-Stock

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2,965

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Argo Parts USA

USA . 2,813 parts In-Stock

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2,813

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Kepictronics

USA . 1,830 parts In-Stock

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1,830

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Parana Technologies

USA . 1,014 parts In-Stock

1+ parts

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$12.999

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1,014

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$12.999

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Modulus Dynamics

Lithuania . 650 parts In-Stock

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650

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Delivering top-notch quality and unmatched performance, the 74LVX3245TTR by STMicroelectronics is a game-changer in the world of Bus Driver & Transceivers. With its state-of-the-art technology and impressive features, this product stands out from the competition. Designed for seamless translation between 3V and 5V, it offers unparalleled flexibility and compatibility. Whether you're working on industrial automation or consumer electronics projects, this versatile solution has got you covered. Experience smooth signal transmission, reduced propagation delay, and a wide operating temperature range. Trust in STMicroelectronics' expertise and elevate your designs to new heights with the 74LVX3245TTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made from durable plastic/epoxy material, making it resistant to shock and vibrations, and ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 9 ns

With a fast propagation delay of only 9 ns, this product allows for quick signal transmission, reducing delays and improving overall efficiency.

Surface Mount: YES

Being surface mount compatible makes this product easy to install, saving valuable space on the PCB and allowing for efficient production processes.

No. of Functions: 1

This product provides a single function, simplifying the design and reducing complexity, which enhances reliability and ease of use.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for easy and secure mounting, maximizing space utilization and ensuring stable connectivity.

No. of Bits: 8

With 8 bits, this product enables high-resolution data transmission, making it suitable for applications that require precise and accurate data handling.

Translation: 3V & 5V

The ability to translate between 3V and 5V signals allows for seamless integration with various systems and ensures compatibility with different voltage levels.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this product offers energy efficiency and compatibility with a wide range of power sources.

Power Supplies (V): 3.3,5

Supporting power supplies of 3.3V and 5V, this product provides flexibility and compatibility with different power configurations, allowing for versatile usage.

No. of Terminals: 24

With 24 terminals, this product offers ample connectivity options, enabling the connection of multiple devices or components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this product allow for compact integration, minimizing space requirements and facilitating high-density designs.

Maximum I (ol): 24 Amp

This product has a high maximum output current of 24 Amps, making it suitable for applications requiring high power transmission, such as driving heavy loads.

Propagation Delay (tpd): 10 ns

With a propagation delay of only 10 ns, this product ensures fast signal transmission, reducing delays and increasing overall system responsiveness.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, ensuring reliable performance in demanding conditions.

Output Characteristics: 3-STATE

This product features 3-STATE output characteristics, allowing for multi-level output states and enabling efficient bus sharing in multi-device communication systems.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can withstand extremely low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

This product features dual terminal positions, offering flexibility in PCB layout and allowing for convenient integration into various system designs.

No. of Ports: 2

With 2 ports, this product enables simultaneous communication with multiple devices or systems, enhancing efficiency and versatility.

Maximum Seated Height: 1.1 mm

The maximum seated height of 1.1 mm ensures a compact form factor, making this product suitable for space-constrained applications or designs with low-profile requirements.

Width: 4.4 mm

With a width of 4.4 mm, this product provides a compact footprint, facilitating efficient use of available space on the PCB and allowing for high-density designs.

Output Polarity: TRUE

The output polarity of TRUE guarantees accurate and reliable signal transmission, ensuring compatibility with other devices and systems.

Minimum Supply Voltage (Vsup): 2.7 V

Operating at a minimum supply voltage of 2.7V, this product offers flexibility in power input, accommodating lower voltage power sources and optimizing energy consumption.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product can withstand the reflow soldering process, simplifying manufacturing and assembly.

Peak Reflow Temperature °C: 260

This product can withstand a peak reflow temperature of 260°C, ensuring reliable solder joints during the PCB assembly process.

Length: 7.8 mm

With a length of 7.8 mm, this product offers a compact size, enabling efficient PCB design and allowing for integration into space-limited applications.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product provides exceptional reliability, robustness, and performance, making it suitable for demanding applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and excellent compatibility with various logic families, ensuring efficient and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form of this product facilitates easy surface mount soldering, ensuring strong and reliable connections during the assembly process.

Packing Method: TR

This product is packed in a tape and reel configuration, allowing for automated pick-and-place assembly, simplifying manufacturing processes and reducing assembly time.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm enables high-density mounting, allowing for the incorporation of numerous components within a small area, leading to compact and space-efficient designs.

Count Direction: BIDIRECTIONAL

Supporting bidirectional count direction, this product allows for communication or data transfer in both directions, enhancing versatility and flexibility in various applications.

Control Type: COMMON CONTROL

This product features a common control type, enabling centralized control and simplifying system integration, enhancing overall efficiency and ease of use.

Maximum Supply Voltage (Vsup): 3.6 V

Operating at a maximum supply voltage of 3.6V, this product provides flexibility in power input, accommodating higher voltage power sources, and ensuring proper functioning.

Technical Specifications

Bus Driver & Transceivers 74LVX3245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

PORT B OPERATES AT 4.5V TO 5.5V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

4.4 mm

Trade Compliance

74LVX3245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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