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74LVX244MTR

STMicroelectronics

74LVX244MTR by STMicroelectronics

74LVX244MTR by STMicroelectronics is a CMOS bus driver featuring a 13 ns propagation delay and operates at a nominal voltage of 3.3V. With 4 bits and dual ports, it’s ideal for high-speed data transmission in military applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,084 parts In-Stock

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Digiode

USA . 2,246 parts In-Stock

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Anansix

USA . 1,479 parts In-Stock

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1,479

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,618 parts In-Stock

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$2.519

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1,618

$2.519

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Microchip USA

USA . 376 parts In-Stock

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$7.060

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$7.060

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$7.060

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$7.060

376

$7.060

$7.060

$7.060

$7.060

AZTECH Wire

Italy . 672 parts In-Stock

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$12.190

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672

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IDEA Electronic Components Group

UK . 955 parts In-Stock

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$14.546

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$13.092

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955

$14.546

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$13.092

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MKK Technologies

India . 521 parts In-Stock

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$27.353

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521

$27.353

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DigiPath Technology Company

USA . 521 parts In-Stock

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$27.353

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$27.353

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Kepictronics

USA . 1,944 parts In-Stock

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Parana Technologies

USA . 1,749 parts In-Stock

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$17.392

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Perfect Parts

USA . 193 parts In-Stock

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Corphita

USA . 133 parts In-Stock

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Native Components

USA . 81 parts In-Stock

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Overview

Unlock your project’s potential with the 74LVX244MTR from STMicroelectronics—a trusted name in quality and innovation. This versatile bus driver excels in high-speed applications, ensuring seamless data transmission with exceptional reliability. Ideal for embedded systems, consumer electronics, and automotive solutions, it delivers efficiency and durability, empowering you to create cutting-edge designs that stand the test of time. Choose ST for superior performance and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protects against moisture, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 13 ns

A low propagation delay enhances the speed of data transmission, allowing for high-performance applications.

Surface Mount: YES

Surface mount technology allows for easy integration into modern circuit boards, saving space and improving assembly efficiency.

No. of Functions: 2

Having multiple functions in a single package reduces component count and simplifies design, increasing overall system reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, making it easier to arrange components efficiently.

No. of Bits: 4

Supports a 4-bit data bus, suitable for a variety of applications requiring moderate data throughput.

Nominal Supply Voltage / Vsup (V): 2.7

A low nominal supply voltage of 2.7 V helps in reducing power consumption, making it energy efficient.

Load Capacitance (CL): 50 pF

This load capacitance ensures compatibility with various applications, minimizing signal degradation.

Power Supplies (V): 3.3

Operates at a standard 3.3 V supply, commonly used in digital circuits, providing flexibility in system design.

No. of Terminals: 20

With 20 terminals, this device supports a variety of connections, enhancing its versatility in design applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact footprint, ideal for space-constrained applications.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps allows it to drive loads effectively, ideal for interfacing with high current devices.

Propagation Delay (tpd): 18 ns

An overall propagation delay of 18 ns indicates the device's suitability for high-speed applications.

Maximum Operating Temperature: 125 °C

Designed to operate at high temperatures, it is suitable for demanding environments and industrial applications.

Output Characteristics: 3-STATE

The 3-state output allows for flexibility in bus systems, facilitating communication between multiple devices.

Minimum Operating Temperature: -55 °C

Suitable for extreme low-temperature applications, making it ideal for aerospace and military use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish improves solderability and enhances durability over time.

Terminal Position: DUAL

Dual terminal positioning allows for easier routing in space-constrained designs.

No. of Ports: 2

With two ports, it enables communication between two separate buses or interfaces, enhancing connectivity.

Maximum Seated Height: 2.65 mm

Low seated height allows for a more compact design, accommodating more components in smaller areas.

Width: 7.5 mm

A width of 7.5 mm is efficient for integration into tight PCB layouts, optimizing space utilization.

Output Polarity: TRUE

The true output polarity provides consistent logic levels, simplifying design requirements.

Minimum Supply Voltage (Vsup): 2 V

Operating with a minimum supply voltage of 2 V adds versatility for various power systems and applications.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow ensures robust solder joint formation, enhancing reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows it to withstand standard soldering processes, ensuring compatibility with manufacturing.

Length: 12.8 mm

At 12.8 mm in length, it fits well into compact designs, maximizing space efficiency.

Temperature Grade: MILITARY

MILITARY temperature grade certification ensures reliability in harsh environments and critical applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and contribute to effective heat dissipation.

Packing Method: TR

Tape and reel packaging allows for automated assembly, improving production efficiency.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch enables compatibility with a wide range of PCB layouts and designs.

Control Type: ENABLE LOW

ENABLE LOW control type allows for easy integration into digital circuits for ON/OFF applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 classification means it is suitable for standard handling and storage, ensuring reliability over time.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for various applications while ensuring device safety.

Technical Specifications

Bus Driver & Transceivers 74LVX244MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74LVX244MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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