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74LVX16245TTR

STMicroelectronics

74LVX16245TTR by STMicroelectronics

74LVX16245TTR by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 13.5 ns, operating b/w 2.0V and 3.6V. It features a compact SO package and supports bidirectional data flow, ideal for high-speed communication in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,779 parts In-Stock

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4,779

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Vyrian

USA . 4,474 parts In-Stock

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4,474

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Anansix

USA . 2,287 parts In-Stock

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2,287

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 457 parts In-Stock

1+ parts

$1.000

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-

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-

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457

$1.000

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AZTECH Wire

Italy . 880 parts In-Stock

1+ parts

$18.000

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880

$18.000

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IDEA Electronic Components Group

UK . 58 parts In-Stock

1+ parts

$21.534

100+ parts

-

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$19.381

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58

$21.534

-

$19.381

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MKK Technologies

India . 588 parts In-Stock

1+ parts

$40.494

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588

$40.494

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DigiPath Technology Company

USA . 588 parts In-Stock

1+ parts

$40.494

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588

$40.494

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Corphita

USA . 2,058 parts In-Stock

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2,058

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Northwest PG Solutions

USA . 651 parts In-Stock

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$3.984

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651

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$3.984

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Parana Technologies

USA . 249 parts In-Stock

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$25.748

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249

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$25.748

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Native Components

USA . 147 parts In-Stock

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$3.943

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147

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$3.943

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Overview

Unlock unparalleled performance and reliability with the 74LVX16245TTR from STMicroelectronics, a leading name in innovative semiconductor solutions. Designed for high-speed data transmission, this robust bus driver offers exceptional versatility across diverse applications—from telecommunications to industrial automation. With its compact, thin-profile design and superior temperature tolerance, it’s ideal for demanding environments, ensuring your projects achieve optimal efficiency without compromise. Experience quality you can trust and elevate your designs with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust protection against environmental factors, making this product reliable for various applications.

Propagation Delay At Nominal Supply: 13.5 ns

A low propagation delay allows for faster data transmission, enhancing overall system performance.

Surface Mount: YES

Surface mount capability enables a compact design and simplifies automated assembly processes.

No. of Functions: 2

Multi-function capability provides versatility, allowing the device to handle multiple tasks efficiently.

Package Shape: RECTANGULAR

The rectangular shape is compatible with standard PCB layouts, facilitating easy integration into existing designs.

No. of Bits: 8

An 8-bit configuration is suitable for a wide range of applications, providing a balance between performance and complexity.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V enhances power efficiency while maintaining strong performance.

Power Supplies (V): 3.3

Compatibility with 3.3V power supplies makes this device suitable for modern digital circuits.

No. of Terminals: 48

A larger number of terminals allows for increased connectivity options and flexibility in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate space-saving designs ideal for compact applications.

Maximum I (ol): 4 Amp

A high output current capacity of 4 Amp enables the device to drive larger loads effectively.

Propagation Delay (tpd): 14 ns

Quick switch times reduce latency in data transmission, beneficial for high-speed applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in demanding environments.

Output Characteristics: 3-STATE

3-state output capabilities provide flexibility in bus systems, allowing devices to share communication lines effectively.

Minimum Operating Temperature: -55 °C

Excellent low-temperature operation makes this device suitable for extreme conditions commonly found in military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures reliable connectivity and resistance against corrosion, enhancing product longevity.

Terminal Position: DUAL

Dual terminal positioning optimizes space and makes routing simpler on printed circuit boards.

No. of Ports: 2

Having two ports allows for bidirectional communication, increasing the device's versatility in network applications.

Maximum Seated Height: 1.2 mm

A low seated height aids in dense PCB layouts, promoting efficient use of space without compromising performance.

Width: 6.1 mm

The compact width helps in fitting the device into tight spaces, advantageous for miniaturized electronics.

Output Polarity: TRUE

The true output polarity is suitable for various circuit configurations, making it a flexible choice for different designs.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage increases compatibility with a broader range of systems, making this product highly adaptable.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures compatibility with modern soldering techniques, enhancing the assembly process.

Length: 12.5 mm

This specific length contributes to a compact design, ideal for space-constrained applications.

Temperature Grade: MILITARY

Military-grade temperature classification guarantees reliability and robustness in extreme conditions, suitable for defense and aerospace applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed operation, making this device efficient and effective.

Terminal Form: GULL WING

Gull-wing terminals provide a reliable connection and facilitate easier soldering, improving assembly efficiency.

Packing Method: TR

Tape and reel (TR) packing method simplifies automation in handling and placement during PCB assembly.

Terminal Pitch: 0.5 mm

The small terminal pitch is advantageous for high-density designs, allowing more connections in a reduced area.

Count Direction: BIDIRECTIONAL

Bidirectional count direction increases the versatility of the device in various applications, enhancing communication capabilities.

Control Type: COMMON CONTROL

Common control type simplifies system design by enabling coordinated operation with minimal external components.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows for robust operation while remaining safe for standard logic levels.

Technical Specifications

Bus Driver & Transceivers 74LVX16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74LVX16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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