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74LVX16244TTR

STMicroelectronics

74LVX16244TTR by STMicroelectronics

74LVX16244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of 13.5 ns and operates at supply voltages from 2 to 3.6 V. It features 4 functions, supports dual ports, and is ideal for high-speed data transmission in compact designs. Its military-grade specs ensure reliability in extreme conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,414 parts In-Stock

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Anansix

USA . 2,564 parts In-Stock

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Digiode

USA . 2,165 parts In-Stock

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Native Components

USA . 703 parts In-Stock

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$1.401

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703

$1.401

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Northwest PG Solutions

USA . 1,481 parts In-Stock

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$1.541

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$1.541

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Andel Nordic

Denmark . 996 parts In-Stock

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$1.862

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$1.787

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$1.787

996

$1.862

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$1.787

$1.787

Microchip USA

USA . 459 parts In-Stock

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$6.544

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459

$6.544

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IDEA Electronic Components Group

UK . 870 parts In-Stock

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$15.956

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$14.360

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870

$15.956

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$14.360

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AZTECH Wire

Italy . 285 parts In-Stock

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$20.570

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$20.570

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MKK Technologies

India . 507 parts In-Stock

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$30.003

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$30.003

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DigiPath Technology Company

USA . 507 parts In-Stock

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$30.003

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507

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QUARKTWIN TECHNOLOGY LTD

USA . 14,893 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,034 parts In-Stock

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Kepictronics

USA . 4,292 parts In-Stock

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Metaverse IC Inc.

Canada . 3,792 parts In-Stock

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Corphita

USA . 3,164 parts In-Stock

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Parana Technologies

USA . 2,271 parts In-Stock

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$19.077

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Perfect Parts

USA . 2,240 parts In-Stock

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Overview

Elevate your designs with the 74LVX16244TTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality bus driver and transceiver promises exceptional performance with reliable power management across various applications, from industrial automation to consumer electronics. Its compact design ensures smooth integration, while low propagation delays enhance overall efficiency. Experience unmatched durability and peace of mind with ST's commitment to excellence—perfect for powering your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 13.5 ns

A low propagation delay ensures fast signal transmission, enhancing overall system performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient space utilization on PCBs.

No. of Functions: 4

Having multiple functions increases versatility, enabling integration into more complex circuits.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for efficient layout and offers a better fit in tightly packed circuit designs.

No. of Bits: 4

The 4-bit architecture is well-suited for various applications that require moderate data handling capabilities.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal operating voltage ensures energy efficiency and compatibility with modern low-power systems.

Power Supplies (V): 3.3

Designed to operate at 3.3V, it's compatible with most microcontrollers and digital logic circuits.

No. of Terminals: 48

With 48 terminals, the device facilitates numerous connection options for complex configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile allows for space efficiency, crucial for portable and compact electronic devices.

Maximum I (ol): 4 Amp

A high output current capability (4 A) supports powerful drives for various load requirements.

Propagation Delay (tpd): 18 ns

An acceptable propagation delay ensures adequate switching speed for most applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, the device is suitable for harsh environments and industrial applications.

Output Characteristics: 3-STATE

3-state output allows for greater flexibility in bus systems, enabling multiple devices to connect without interference.

Minimum Operating Temperature: -55 °C

The ability to function at low temperatures expands its usage in environments where extreme cooling occurs.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures superior conductivity and prevents corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal position allows for easier integration into varied circuit layouts.

No. of Ports: 2

Having two ports offers expanded connectivity options, ideal for multi-device communications.

Maximum Seated Height: 1.2 mm

The low seated height is beneficial for minimizing space on PCBs and optimizing layering.

Width: 6.1 mm

A compact width aids in high-density circuit designs, promoting innovation in design flexibility.

Output Polarity: TRUE

The true output polarity ensures clear differentiation between high and low states, aiding in signal integrity.

Minimum Supply Voltage (Vsup): 2 V

Supporting a low minimum voltage makes this product compatible with a wide range of power supply options.

Length: 12.5 mm

The moderate length provides a balance of space efficiency without compromising functionality.

Temperature Grade: MILITARY

The military-grade rating signifies superior quality and reliability for critical applications.

Technology: CMOS

Using CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminal form enhances solderability, ensuring secure connections in manufacturing.

Packing Method: TR

Tape and reel packaging optimizes handling and placement in automated assembly processes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for dense circuit layouts, making it highly suitable for miniaturized designs.

Control Type: ENABLE LOW

A low enable control type promotes efficient power management and better signal integrity.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage capability ensures compatibility with various peripheral devices.

Technical Specifications

Bus Driver & Transceivers 74LVX16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74LVX16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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