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74LVX14TTR

STMicroelectronics

74LVX14TTR by STMicroelectronics

74LVX14TTR by STMicroelectronics is a CMOS Schmitt Trigger with a propagation delay of 16 ns, operating b/w 2-3.6 V. It features a compact 14-terminal package and is ideal for signal conditioning in high-speed applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 7,939 parts In-Stock

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Digiode

USA . 4,332 parts In-Stock

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Anansix

USA . 2,610 parts In-Stock

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2,610

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Microfarads

USA . 2,391 parts In-Stock

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North Shore Components

USA . 1,533 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 385 parts In-Stock

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385

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Microchip USA

USA . 203 parts In-Stock

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$0.536

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203

$0.536

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AZTECH Wire

Italy . 237 parts In-Stock

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$8.700

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$8.700

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Native Components

USA . 392 parts In-Stock

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$10.650

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$10.650

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Northwest PG Solutions

USA . 106 parts In-Stock

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$11.715

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$10.543

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$10.543

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IDEA Electronic Components Group

UK . 563 parts In-Stock

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$12.723

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$11.450

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MKK Technologies

India . 247 parts In-Stock

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$23.924

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DigiPath Technology Company

USA . 247 parts In-Stock

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$23.924

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Component Stockers USA

USA . 400 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,743 parts In-Stock

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Perfect Parts

USA . 5,518 parts In-Stock

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Corphita

USA . 3,957 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,007 parts In-Stock

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Parana Technologies

USA . 801 parts In-Stock

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Metaverse IC Inc.

Canada . 600 parts In-Stock

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Kepictronics

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Overview

Elevate your designs with the 74LVX14TTR from STMicroelectronics—an exceptional logic gate that combines reliability and efficiency. Renowned for their commitment to quality, STMicroelectronics ensures this robust component excels in a variety of applications, from automotive to industrial systems. With fast propagation delay and dual functionality, it streamlines operations while maintaining peak performance in extreme temperatures. Choose the 74LVX14TTR and unlock the potential of your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 16 ns

A low propagation delay allows for faster data processing, enhancing the overall performance of electronic circuits.

Surface Mount: YES

Surface mount technology facilitates compact designs and improved automation in assembly processes.

No. of Functions: 6

Having multiple functions increases versatility, enabling this product to be used in various applications without needing multiple components.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient space utilization on PCBs, aiding in compact circuit designs.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7V makes it suitable for low-voltage applications, improving energy efficiency.

Power Supplies (V): 3.3

Operating at a standard 3.3V supply makes it compatible with many modern digital systems.

No. of Terminals: 14

The 14-terminal configuration allows for a wide range of connections and functionalities in circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile promote space-saving designs without compromising on performance.

Propagation Delay (tpd): 23 ns

The propagation delay of 23 ns ensures reliable performance in high-speed applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows for use in demanding environments, enhancing reliability.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures expands the range of applications in harsh conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and enhances long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options in circuit boards.

Maximum Seated Height: 1.2 mm

The low seated height is ideal for low-profile applications where space is limited.

Width: 4.4 mm

A compact width makes it suitable for densely populated PCBs.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for operation with minimal power input, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The tolerance for peak reflow time facilitates adaptability in manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature compatibility allows for assembly with various solder types.

Length: 5 mm

A compact length is ideal for space-constrained designs, making it easier to fit into small enclosures.

Temperature Grade: MILITARY

MILITARY-grade components ensure durability and reliability in extreme conditions, suitable for critical applications.

Schmitt Trigger: YES

The inclusion of a Schmitt Trigger feature enhances signal integrity, making it suitable for noisy environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are optimized for surface mount technology, ensuring easy handling and automated assembly.

Packing Method: TR

Tape and reel (TR) packing method facilitates easy handling and integration into automated assembly lines.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for high-density design, promoting compact circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable moisture durability, ensuring reliability in typical storage conditions.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of systems while maximizing performance.

Technical Specifications

Logic Gates 74LVX14TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVX14TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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