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74LVX139TTR

STMicroelectronics

74LVX139TTR by STMicroelectronics

74LVX139TTR by STMicroelectronics is a CMOS decoder/driver with a propagation delay of just 14.5 ns and operates at a nominal voltage of 3.3 V. It features dual functions in a compact SOIC package, ideal for high-speed digital applications. With a max temp of 125 °C, it's suitable for military-grade use.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 4,905 parts In-Stock

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Vyrian

USA . 2,458 parts In-Stock

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Digiode

USA . 1,139 parts In-Stock

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Anansix

USA . 388 parts In-Stock

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Microchip USA

USA . 232 parts In-Stock

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$0.394

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Native Components

USA . 92 parts In-Stock

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$1.102

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Northwest PG Solutions

USA . 1,346 parts In-Stock

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$1.212

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AZTECH Wire

Italy . 1,092 parts In-Stock

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$9.000

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$9.000

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IDEA Electronic Components Group

UK . 632 parts In-Stock

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$13.263

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$11.936

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MKK Technologies

India . 1,641 parts In-Stock

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$24.940

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DigiPath Technology Company

USA . 1,641 parts In-Stock

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$24.940

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QUARKTWIN TECHNOLOGY LTD

USA . 14,881 parts In-Stock

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Perfect Parts

USA . 10,987 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,905 parts In-Stock

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Corphita

USA . 4,037 parts In-Stock

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Parana Technologies

USA . 2,217 parts In-Stock

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$15.858

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Overview

Elevate your designs with the 74LVX139TTR from STMicroelectronics, a beacon of reliability in the world of decoders and drivers. Renowned for unparalleled quality, STMicroelectronics delivers this high-performance solution with exceptional speed and efficiency, perfect for automotive, industrial, and communication applications. Experience robust functionality within a compact footprint, ensuring seamless integration and superior performance in your projects. Trust in a brand that prioritizes innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 14.5 ns

A low propagation delay ensures quicker signal transmission, making this decoder/driver suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

No. of Functions: 2

With two functions, the product offers versatility, allowing it to be used in multiple applications.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and integrates well into various layouts, enhancing design flexibility.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V ensures efficient energy consumption suited for battery-operated devices.

Load Capacitance (CL): 50 pF

A manageable load capacitance allows stable performance without significant distortion in signal integrity.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies, this device is ideal for low-power applications, enhancing energy efficiency.

No. of Terminals: 16

Sixteen terminals provide ample connectivity options for integration into more complex systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are perfect for space-constrained applications, ensuring a compact footprint.

Maximum I (ol): 4 Amp

This capacity for a high output current makes the product suitable for driving significant loads in various applications.

Propagation Delay (tpd): 19 ns

The propagation delay of 19 ns indicates a fast response time, ensuring effective communication in high-speed circuits.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature extends the usability range, making it reliable in extreme conditions.

Minimum Operating Temperature: -55 °C

The ability to operate in low temperatures ensures reliability in harsh environmental conditions, suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish increases longevity and performance by providing excellent corrosion resistance and electrical conductivity.

Terminal Position: DUAL

The dual terminal position allows for flexible layout options, facilitating easier PCB design.

Maximum Seated Height: 1.2 mm

A low seated height supports dense packaging, ideal for compact electronic devices.

Width: 4.4 mm

A narrow width enhances compatibility with tight spaces in various electronic configurations.

Output Polarity: INVERTED

Inverted output polarity provides design flexibility for specific circuit applications and logic configurations.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage contributes to energy efficiency, making it suitable for a variety of low-power applications.

Length: 5 mm

Short length aids in compact designs and efficient layout, a key factor in modern electronic devices.

Temperature Grade: MILITARY

The military temperature grade ensures robustness and reliability for critical applications in defense and aerospace.

Technology: CMOS

CMOS technology supports low power consumption while maintaining high performance, suitable for high-density applications.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering reliability and makes assembly easier, improving production efficiency.

Packing Method: TR

Tape and reel packing method ensures easy handling and assembly in automated processes, streamlining production.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact placement on PCBs, minimizing space without compromising connectivity.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the component can be handled with standard precautions, reducing risk of damage during assembly.

Maximum Supply Voltage (Vsup): 3.6 V

The capability to operate at a maximum supply voltage of 3.6V provides flexibility in power supply options.

Technical Specifications

Decoder & Drivers 74LVX139TTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX139TTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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