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74LVQ157TTR

STMicroelectronics

74LVQ157TTR by STMicroelectronics

74LVQ157TTR by STMicroelectronics is a CMOS multiplexer with 4 functions, 2 inputs, and propagation delay of 10 ns. It operates at a supply voltage range of 2V to 3.6V, making it suitable for military-grade applications requiring fast switching capabilities in compact designs. This small outline package with dual terminals and nickel palladium gold finish is ideal for surface mount PCBs where space is limited.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 4,809 parts In-Stock

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Digiode

USA . 2,064 parts In-Stock

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Anansix

USA . 549 parts In-Stock

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AZTECH Wire

Italy . 184 parts In-Stock

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$15.670

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IDEA Electronic Components Group

UK . 565 parts In-Stock

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$15.996

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$14.396

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Native Components

USA . 940 parts In-Stock

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$16.227

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Northwest PG Solutions

USA . 1,710 parts In-Stock

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$17.850

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$16.065

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MKK Technologies

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$30.080

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DigiPath Technology Company

USA . 356 parts In-Stock

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Microchip USA

USA . 216 parts In-Stock

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$38.633

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Corphita

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Parana Technologies

USA . 1,772 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the 74LVQ157TTR by STMicroelectronics. As a trusted leader in semiconductor manufacturing, STMicroelectronics delivers top-quality multiplexers and demultiplexers that provide reliable performance in a compact design. Ideal for a wide range of applications, this product offers customers unparalleled value, efficiency, and precision. Trust STMicroelectronics for all your electronic component needs and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for various operating conditions.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast and efficient operation of the multiplexer/demultiplexer, leading to improved overall system performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during assembly.

No. of Functions: 4

With multiple functions in a single device, it offers versatility and flexibility in circuit design and implementation.

No. of Inputs: 2

Having multiple inputs allows for greater connectivity and input options in the system, enhancing its functionality.

Nominal Supply Voltage / Vsup (V): 2.7

Operates within a moderate voltage range, making it compatible with a wide range of systems and power supplies.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable and reliable operation of the device in various circuit configurations.

Power Supplies (V): 3.3

Compatible with standard power supplies, making integration into existing systems easy and seamless.

No. of Terminals: 16

Sufficient number of terminals for connecting inputs, outputs, and power supplies, enabling easy integration into circuits.

Maximum I (ol): 24 Amp

High output current capability allows for driving heavier loads, making it suitable for a wide range of applications.

Propagation Delay (tpd): 13.5 ns

Low propagation delay ensures quick response times and high-speed operation of the device, enhancing system performance.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable operation in harsh environmental conditions, making it suitable for various applications.

Minimum Operating Temperature: -55 °C

Operates effectively at low temperatures, ensuring reliable performance even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures good conductivity and corrosion resistance, enhancing the reliability and longevity of the device.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and component placement, allowing for efficient use of board space.

Maximum Seated Height: 1.2 mm

Low profile design minimizes the space required for installation, making it suitable for compact and space-constrained applications.

Width: 4.4 mm

Compact width allows for easy integration into circuit layouts with limited space, ideal for small-scale electronic devices.

Output Polarity: TRUE

True output polarity ensures correct signal inversion and compatibility with other components in the system, preventing signal errors and distortions.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltages, making it energy-efficient and compatible with battery-powered applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering during assembly, leading to durable and long-lasting connections.

Length: 5 mm

Compact length allows for easy integration into circuit designs with limited space, suitable for miniaturized electronic devices.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme conditions and high reliability in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it suitable for energy-efficient and high-performance systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, facilitating easy soldering and reducing the risk of connectivity issues.

Packing Method: TR

TR (Tape and Reel) packing method enables convenient storage, handling, and automated assembly of the devices, saving time and labor costs.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and compact PCB designs, ideal for space-constrained applications and miniaturized devices.

Maximum Supply Voltage (Vsup): 3.6 V

Operates within a safe maximum supply voltage range, ensuring device protection and compatibility with standard power sources.

Technical Specifications

Multiplexer & Demultiplexer 74LVQ157TTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

LVQ

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVQ157TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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