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74LVC86ATTR

STMicroelectronics

74LVC86ATTR by STMicroelectronics

74LVC86ATTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 4.2 ns, operating b/w 1.65V and 3.6V. It features four functions with two inputs and supports surface mount applications in compact designs. Ideal for military-grade electronics, it withstands temperatures from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,209 parts In-Stock

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6,209

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ComSIT Distribution GmbH

Germany . 3,750 parts In-Stock

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3,750

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Digiode

USA . 79 parts In-Stock

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79

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Anansix

USA . 78 parts In-Stock

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78

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Distributors (Availability)

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Microchip USA

USA . 190 parts In-Stock

1+ parts

$0.368

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190

$0.368

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Native Components

USA . 714 parts In-Stock

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$0.570

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714

$0.570

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Northwest PG Solutions

USA . 89 parts In-Stock

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$0.627

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89

$0.627

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AZTECH Wire

Italy . 834 parts In-Stock

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$18.300

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834

$18.300

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IDEA Electronic Components Group

UK . 667 parts In-Stock

1+ parts

$26.172

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$23.555

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667

$26.172

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$23.555

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MKK Technologies

India . 1,140 parts In-Stock

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$49.215

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1,140

$49.215

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DigiPath Technology Company

USA . 1,140 parts In-Stock

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$49.215

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1,140

$49.215

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Component Stockers USA

USA . 244 parts In-Stock

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$99.990

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Perfect Parts

USA . 4,166 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,860 parts In-Stock

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Corphita

USA . 1,360 parts In-Stock

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Parana Technologies

USA . 731 parts In-Stock

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$31.293

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$31.293

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Overview

Elevate your designs with the 74LVC86ATTR from STMicroelectronics, a pinnacle of reliability in logic gates. Crafted with precision, this versatile component ensures rapid performance with minimal power consumption, making it perfect for space-constrained applications. Trust in STMicroelectronics’ legacy of innovation and excellence to deliver superior quality that enhances your projects—empowering you to achieve efficiency and reliability without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 4.2 ns

A low propagation delay allows for faster signal processing, enhancing the overall performance of the circuit.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into modern electronic devices.

No. of Functions: 4

With four functions, this logic gate offers versatility for complex logic design, reducing the need for additional components.

No. of Inputs: 2

The two-input configuration facilitates straightforward logic operations, making it suitable for common digital circuits.

Package Shape: RECTANGULAR

The rectangular package shape supports efficient space utilization on PCBs, simplifying layout considerations.

Nominal Supply Voltage / Vsup (V): 2.7

This voltage level aligns well with modern low-power applications, ensuring energy efficiency in electronic devices.

Load Capacitance (CL): 50 pF

A low load capacitance contributes to quicker response times, allowing for improved speed in circuit operations.

Power Supplies (V): 3.3

Operating at 3.3V is standard in modern electronics, enhancing compatibility with various systems.

No. of Terminals: 14

Fourteen terminals provide sufficient connectivity options, enabling flexible integration within a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for minimized board space usage, ideal for compact electronic designs.

Maximum I (ol): 24 Amp

This current handling capability ensures that the logic gate can be used in high-current applications without failure.

Propagation Delay (tpd): 12 ns

A moderate propagation delay allows for reliable signal transition, ensuring stable operation in slower circuits.

Maximum Operating Temperature: 125 °C

A high operating temperature rating ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature makes this component suitable for extreme conditions, such as military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, making the product adaptable for different PCBs.

Maximum Seated Height: 1.2 mm

A low seated height supports compatibility with hardware that requires minimal component elevation.

Width: 4.4 mm

A narrow width contributes to the compact design, making it ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.65 V

Lower voltage operation supports energy-efficient designs and is optimal for battery-powered devices.

Length: 5 mm

The short length enhances layout flexibility, facilitating easier routing on dense printed circuit boards.

Temperature Grade: MILITARY

Military-grade components are built to withstand harsh environments, ensuring reliability in critical applications.

Technology: CMOS

CMOS technology allows for low static power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process and enhance the reliability of the joint.

Packing Method: TR

Tape and reel packing makes it easy to handle and automate the assembly process, increasing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A compact terminal pitch allows for higher density mounting, making it suitable for modern electronics.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage is standard for many digital devices, ensuring compatibility with a wide range of applications.

Technical Specifications

Logic Gates 74LVC86ATTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVC86ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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