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74LVC244ATTR

STMicroelectronics

74LVC244ATTR by STMicroelectronics

74LVC244ATTR by STMicroelectronics is a CMOS bus driver featuring a fast propagation delay of 7.1 ns and operates within a supply voltage range of 1.65V to 3.6V. With its compact SOIC package, it supports dual-port applications in military-grade environments. This device ensures reliable performance with true output polarity and robust temperature tolerance from -55 °C to 125°C.

Median Price

$1.594

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,720 parts In-Stock

1+ parts

$1.149

100+ parts

-

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1,720

$1.149

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Chip1Stop

Japan . 1,720 parts In-Stock

1+ parts

$2.040

100+ parts

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1,720

$2.040

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Verical

USA . 1,720 parts In-Stock

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1,720

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Distributors (In-Stock)

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Digiode

USA . 2,124 parts In-Stock

1+ parts

$1.092

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2,124

$1.092

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Chip Stock

USA . 22,810 parts In-Stock

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22,810

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Vyrian

USA . 3,377 parts In-Stock

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3,377

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Bristol Electronics

USA . 3,316 parts In-Stock

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3,316

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Dan-Mar Components

USA . 3,316 parts In-Stock

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3,316

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ACDS - Activité Composants Distribution Service

France . 1,991 parts In-Stock

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1,991

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PC Components Company LLC

USA . 1,925 parts In-Stock

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1,925

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SPM Sales

USA . 1,820 parts In-Stock

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1,820

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Anansix

USA . 1,497 parts In-Stock

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1,497

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Distributors (Availability)

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Corphita

USA . 2,688 parts In-Stock

1+ parts

$1.034

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2,688

$1.034

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Andel Nordic

Denmark . 4,150 parts In-Stock

1+ parts

$6.954

100+ parts

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$6.676

10k+ parts

$6.676

4,150

$6.954

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$6.676

$6.676

IDEA Electronic Components Group

UK . 1,982 parts In-Stock

1+ parts

$15.961

100+ parts

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$14.365

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1,982

$15.961

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$14.365

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AZTECH Wire

Italy . 153 parts In-Stock

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$17.220

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153

$17.220

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MKK Technologies

India . 2,144 parts In-Stock

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$30.014

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2,144

$30.014

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DigiPath Technology Company

USA . 2,144 parts In-Stock

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$30.014

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2,144

$30.014

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RC Electronics

USA . 17,100 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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S.R.D Solutions

India . 4,375 parts In-Stock

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Perfect Parts

USA . 4,252 parts In-Stock

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Microchip USA

USA . 2,819 parts In-Stock

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Parana Technologies

USA . 1,449 parts In-Stock

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$19.084

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Native Components

USA . 763 parts In-Stock

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Northwest PG Solutions

USA . 252 parts In-Stock

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252

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Overview

Elevate your designs with the 74LVC244ATTR from STMicroelectronics, a top-tier bus driver and transceiver that ensures reliable performance in demanding environments. Renowned for their commitment to quality, STMicroelectronics delivers advanced solutions that enhance efficiency and reduce power consumption. Ideal for communication systems, consumer electronics, and automotive applications, this product offers outstanding switching speeds and robust reliability, empowering you to create innovative, high-performance devices with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection of the internal components, making it suitable for various environments.

Propagation Delay At Nominal Supply: 7.1 ns

A low propagation delay allows for faster signal transmission, making this device suitable for high-speed applications.

Surface Mount: YES

Surface mount technology facilitates easier integration into modern circuit boards, conserving space and improving performance.

No. of Functions: 2

Having multiple functions in a single device enables more compact designs and reduces component count.

Package Shape: RECTANGULAR

A rectangular shape optimizes layout and minimizes space consumption on the PCB.

No. of Bits: 4

This product can handle 4 bits of data concurrently, making it efficient for parallel data processing.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7 V is suitable for battery-powered applications, ensuring energy efficiency.

Power Supplies (V): 3.3

Compatible with 3.3 V power supply systems, this product fits seamlessly into a wide range of electronic applications.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for various circuits and ensure ease of integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Its small outline and thin profile make it ideal for space-constrained designs without sacrificing performance.

Maximum I (ol): 24 Amp

High output drive capability at 24 Amps allows for driving larger loads and reduces the need for additional amplifiers.

Propagation Delay (tpd): 12 ns

A short propagation delay ensures minimal signal delay, which is critical for fast data transfer applications.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures up to 125 °C makes it suitable for use in demanding environments.

Output Characteristics: 3-STATE

3-state output allows for flexible control in multi-device configurations, preventing signal conflicts.

Minimum Operating Temperature: -55 °C

The ability to operate in extreme cold environments (-55 °C) expands the range of applications, especially in military or aerospace.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes ensure excellent conductivity and long-term reliability in various conditions.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility and simplifies PCB layout.

No. of Ports: 2

Offering 2 ports allows for versatile configurations in digital circuits, accommodating multiple signal pathways.

Maximum Seated Height: 1.2 mm

A low profile aids in space-saving design, essential for compact electronic devices.

Width: 4.4 mm

The narrow width facilitates integration into small form-factor PCBs.

Output Polarity: TRUE

True output polarity indicates positive logic levels, providing compatibility with a wide range of digital systems.

Minimum Supply Voltage (Vsup): 1.65 V

Starts operating at as low as 1.65 V, enhancing adaptability for low-power applications.

Maximum Time At Peak Reflow Temperature (s): 40

A longer reflow time enhances solder joint quality, ensuring reliable connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures compatibility with lead-free solder processes.

Length: 6.5 mm

Short length aids in compact designs, making it suitable for high-density applications.

Temperature Grade: MILITARY

Designed to meet military specifications, providing assurance of reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form ensures excellent solderability and mechanical stability on PCBs.

Packing Method: TR

Taped and reeled (TR) packing method simplifies automated assembly processes.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for higher density mounting, fitting more functionality into smaller PCBs.

Control Type: ENABLE LOW

Enable low control type ensures easy integration into systems where active-low logic is standard.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, guiding proper handling and storage practices.

Maximum Supply Voltage (Vsup): 3.6 V

Operating at a maximum of 3.6 V allows for compatibility with standard digital systems while ensuring safe operation.

Technical Specifications

Bus Driver & Transceivers 74LVC244ATTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.1 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

74LVC244ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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