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74LCX125MTR

STMicroelectronics

74LCX125MTR by STMicroelectronics

74LCX125MTR by STMicroelectronics is a bus driver & transceiver with a propagation delay of 5.2 ns and a load capacitance of 50 pF. It is commonly used in applications requiring true output polarity and a max operating temperature of 125°C.

Median Price

$0.629

Lifecycle Status

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15

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Nova Conductors

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Vyrian

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Semtec, LLC

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Zilex Electronics Inc.

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Sensible Micro Corp

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Prism Electronics

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Bristol Electronics

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Dan-Mar Components

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ComSIT Distribution GmbH

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Elcom Components

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Corohmni

South Africa . 342 parts In-Stock

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Continental Prestige Electronics

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$0.616

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Argo Parts USA

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$0.610

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Netroflash

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$0.598

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$0.585

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$0.629

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$0.585

Andel Nordic

Denmark . 3,411 parts In-Stock

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$1.918

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$1.842

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$1.842

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AZTECH Wire

Italy . 797 parts In-Stock

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$6.124

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Semicontronic

India . 1,638 parts In-Stock

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$9.750

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$9.700

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IDEA Electronic Components Group

UK . 785 parts In-Stock

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$11.874

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Microchip USA

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$12.500

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$12.500

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Aztec Data Supply Inc.

USA . 3,040 parts In-Stock

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MKK Technologies

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DigiPath Technology Company

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Ampacity Inc.

Singapore . 409 parts In-Stock

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Component Stockers USA

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Perfect Parts

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A-Z Elektronik GmbH

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Corphita

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Parana Technologies

USA . 698 parts In-Stock

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Overview

Looking for a high-quality bus driver and transceiver that delivers exceptional performance? Look no further than the 74LCX125MTR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics is renowned for its superior products and cutting-edge technology. The 74LCX125MTR offers customers unmatched value, benefits, and advantages. With its compact design and surface mount capability, it is perfect for applications where space is limited. Its true output polarity and 3-state output characteristics ensure reliable and efficient operation. Whether you're working on military-grade projects or require precise control in your designs, this CMOS technology gem will exceed your expectations. Trust STMicroelectronics and experience the difference firsthand with the 74LCX125MTR!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product is made of durable plastic/epoxy material, ensuring long-lasting performance and protection against damage.

Propagation Delay At Nominal Supply:

5.2 ns - With a low propagation delay, this product allows for fast and efficient signal transmission, reducing delays in bus communication.

Surface Mount:

YES - The surface mount feature enables easy installation and integration into various electronic devices, making it a convenient option for bus driver and transceiver applications.

No. of Functions:

4 - This product offers multiple functions in a single device, allowing for simplified circuit designs and reducing the need for additional components.

Package Shape:

RECTANGULAR - The rectangular package shape makes this product compatible with standard PCB layouts and ensures easy placement and connection within electronic systems.

Nominal Supply Voltage / Vsup (V):

2.7 - With a nominal supply voltage of 2.7V, this product is designed to operate efficiently within low voltage systems, leading to energy savings.

Load Capacitance (CL):

50 pF - The specified load capacitance of 50 pF ensures compatibility with a wide range of devices and circuitry, enhancing signal stability and reducing interference.

Power Supplies (V):

3.3 - This product operates at a moderate power supply voltage of 3.3V, making it suitable for a variety of bus driver and transceiver applications.

No. of Terminals:

14 - With 14 terminals, this product provides ample connectivity options and enables easy interfacing with external circuitry and devices.

Package Style (Meter):

SMALL OUTLINE - The small outline package style allows for compact circuit designs and space-saving installations, making it an efficient choice for bus driver and transceiver applications with limited space available.

Maximum I (ol):

24 Amp - The high maximum output current of 24 Amp ensures robust and reliable drive capability, enabling the product to handle demanding bus communication requirements.

Propagation Delay (tpd):

6.9 ns - This product's low propagation delay of 6.9 ns contributes to efficient and reliable signal transmission, enhancing overall bus communication performance.

Maximum Operating Temperature:

125 °C - With a high maximum operating temperature of 125°C, this product is suitable for use in demanding environments and ensures reliable operation even under elevated temperatures.

Output Characteristics:

3-STATE - The 3-STATE output characteristics provide flexibility in controlling the bus signals and allow for effective bus sharing, enhancing the versatility of this product.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature of -55°C ensures reliable performance in extreme cold conditions, making this product suitable for a wide range of environments.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The use of quality terminal finish materials such as nickel, palladium, and gold ensures excellent electrical conductivity and corrosion resistance, enhancing the product's reliability.

Terminal Position:

DUAL - With a dual terminal position, this product provides flexibility in terms of device layout and enables easy PCB assembly and soldering operations.

No. of Ports:

2 - The availability of two ports allows for simultaneous communication with multiple devices, expanding the connectivity options and making this product suitable for bus communication networks.

Maximum Seated Height:

1.75 mm - With a low maximum seated height of 1.75 mm, this product offers a compact profile, allowing for space-efficient integration into various electronic systems.

Width:

3.9 mm - The narrow width of 3.9 mm enables easy integration into crowded PCB layouts and contributes to efficient use of space in bus driver and transceiver applications.

Output Polarity:

TRUE - The true output polarity ensures accurate and reliable signal transmission, reducing the risk of errors and enhancing the overall performance of bus communication.

Minimum Supply Voltage (Vsup):

2 V - The low minimum supply voltage requirement of 2V allows for compatibility with a wide range of systems and offers flexibility in power supply options.

Maximum Time At Peak Reflow Temperature (s):

30 - With a maximum time allowance of 30 seconds at peak reflow temperature, this product simplifies the assembly process and ensures reliable soldering.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature of 260°C ensures proper soldering, maintaining solder joint integrity and improving the durability of the product in commercial and industrial applications.

Length:

8.65 mm - The compact length of 8.65 mm contributes to a small footprint, making this product suitable for space-constrained bus driver and transceiver applications.

Temperature Grade:

MILITARY - Designed to operate within military-grade temperature ranges, this product ensures high reliability and performance even in the most challenging environments.

Technology:

CMOS - Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for bus driver and transceiver applications.

Terminal Form:

GULL WING - The gull-wing terminal form provides a reliable and secure electrical connection, ensuring proper contact and easy soldering during assembly.

Packing Method:

TR - This product is packed in tape and reel format, allowing for efficient handling and automatic placement during the manufacturing process.

Terminal Pitch:

1.27 mm - The small terminal pitch of 1.27 mm enables high-density circuit integration and facilitates automated assembly processes, contributing to cost-effective production.

Control Type:

ENABLE LOW - The enable low control type allows for easy and effective control of the bus signals, providing reliable data transmission and enabling efficient bus sharing.

Maximum Supply Voltage (Vsup):

3.6 V - With a maximum supply voltage of 3.6V, this product can operate effectively within a wide range of voltage levels, ensuring compatibility with various systems and applications.

Technical Specifications

Bus Driver & Transceivers 74LCX125MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LCX125MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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