Loading...

74ALVCH32245LBR

STMicroelectronics

74ALVCH32245LBR by STMicroelectronics

74ALVCH32245LBR by STMicroelectronics is a low-profile bus driver with a propagation delay of just 3 ns, supporting bidirectional data flow. It operates at a nominal voltage of 3.3 V and features 32 functions across 96 terminals. Ideal for industrial applications, it withstands temperatures from -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,310

-

-

-

-

Digiode

USA . 2,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,660

-

-

-

-

Anansix

USA . 850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

850

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,086 parts In-Stock

1+ parts

$17.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,086

$17.380

-

-

-

IDEA Electronic Components Group

UK . 1,522 parts In-Stock

1+ parts

$18.387

100+ parts

-

1k+ parts

$16.548

10k+ parts

-

1,522

$18.387

-

$16.548

-

MKK Technologies

India . 1,498 parts In-Stock

1+ parts

$34.576

100+ parts

-

1k+ parts

-

10k+ parts

-

1,498

$34.576

-

-

-

DigiPath Technology Company

USA . 1,498 parts In-Stock

1+ parts

$34.576

100+ parts

-

1k+ parts

-

10k+ parts

-

1,498

$34.576

-

-

-

Microchip USA

USA . 233 parts In-Stock

1+ parts

$40.987

100+ parts

-

1k+ parts

-

10k+ parts

-

233

$40.987

-

-

-

Native Components

USA . 403 parts In-Stock

1+ parts

$1,463.000

100+ parts

$1,433.740

1k+ parts

$1,419.110

10k+ parts

$1,404.480

403

$1,463.000

$1,433.740

$1,419.110

$1,404.480

Northwest PG Solutions

USA . 1,646 parts In-Stock

1+ parts

$1,609.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,646

$1,609.300

-

-

-

Corphita

USA . 2,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,414

-

-

-

-

Parana Technologies

USA . 954 parts In-Stock

1+ parts

-

100+ parts

$21.985

1k+ parts

-

10k+ parts

-

954

-

$21.985

-

-

Overview

Unlock the power of seamless data transfer with the 74ALVCH32245LBR from STMicroelectronics. Renowned for their unwavering commitment to quality and innovation, STMicroelectronics delivers a bus driver and transceiver that excels in performance and reliability. With its low power consumption and robust design, this component is perfect for a range of applications—from automotive to industrial controls—empowering your designs with speed and efficiency. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances reliability and helps protect against environmental factors.

Propagation Delay At Nominal Supply: 3 ns

A low propagation delay ensures fast signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and easier automation in manufacturing.

No. of Functions: 32

With 32 functions, this product can accommodate complex signal routing in various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for versatile integration into various designs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V helps ensure low-power consumption and is compatible with modern digital systems.

Power Supplies (V): 3.3

The 3.3V power supply is commonly used in many digital circuits, ensuring compatibility with a wide range of devices.

No. of Terminals: 96

A high terminal count enables extensive connectivity options for complex circuit designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low profile grid array style allows for efficient space utilization and better thermal performance.

Maximum I (ol): 24 Amp

With a maximum output current of 24A, it provides sufficient power handling for demanding applications.

Propagation Delay (tpd): 3.7 ns

The fast propagation delay ensures minimal latency in signal processing, which is critical for high-speed communication.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C enables use in a variety of industrial applications, ensuring reliability.

Output Characteristics: 3-STATE

The 3-state output capability allows for effective bus control in multi-device systems.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this product suitable for harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

The tin silver copper finish provides excellent solderability and enhances long-term reliability.

Terminal Position: BOTTOM

Bottom-terminated terminals allow for efficient PCB design and optimal electrical performance.

No. of Ports: 2

Having two ports facilitates easy connection and communication between multiple devices.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a compact design that fits in space-limited applications.

Width: 5.5 mm

The compact width allows for effective multi-component layouts on the PCB.

Output Polarity: TRUE

The true output polarity ensures compatibility with a variety of logic levels and simplifies circuit design.

Minimum Supply Voltage (Vsup): 1.65 V

A minimum supply voltage of 1.65V helps to maintain the versatility of the device across various applications.

Length: 13.5 mm

The length is optimized for high-density PCB layouts, allowing for more compact designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial use indicates robustness and durability suitable for rigorous applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high efficiency, beneficial for battery-operated devices.

Terminal Form: BALL

Ball terminal form aids in reducing stress on the solder joints and improves connection reliability.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for high-density connections, enabling compact designs without sacrificing functionality.

Count Direction: BIDIRECTIONAL

Bidirectional counting enhances flexibility in data transfer, making it suitable for various applications.

Control Type: COMMON CONTROL

The common control type simplifies integration with existing systems, improving overall system design efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

Operating with a maximum supply voltage of 3.6V ensures compatibility with many electronic devices while providing reliable performance.

Technical Specifications

Bus Driver & Transceivers 74ALVCH32245LBR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

CMOS

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

32

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Translation:

N/A

Width:

5.5 mm

Trade Compliance

74ALVCH32245LBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20