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74ALVCH16245TTR

STMicroelectronics

74ALVCH16245TTR by STMicroelectronics

74ALVCH16245TTR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3 ns, supporting bidirectional data transfer. It operates b/w 1.65V and 3.6V, making it ideal for low-voltage applications. With a compact design and military-grade temperature range (-55 °C to 125 °C), it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,531 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,531

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Anansix

USA . 2,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,012

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Digiode

USA . 1,180 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 642 parts In-Stock

1+ parts

$3.004

100+ parts

-

1k+ parts

$2.884

10k+ parts

$2.884

642

$3.004

-

$2.884

$2.884

Native Components

USA . 681 parts In-Stock

1+ parts

$4.965

100+ parts

-

1k+ parts

-

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681

$4.965

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$13.561

100+ parts

-

1k+ parts

$12.205

10k+ parts

-

1,729

$13.561

-

$12.205

-

Microchip USA

USA . 113 parts In-Stock

1+ parts

$19.351

100+ parts

-

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113

$19.351

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AZTECH Wire

Italy . 1,170 parts In-Stock

1+ parts

$22.030

100+ parts

-

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1,170

$22.030

-

-

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MKK Technologies

India . 411 parts In-Stock

1+ parts

$25.500

100+ parts

-

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411

$25.500

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DigiPath Technology Company

USA . 411 parts In-Stock

1+ parts

$25.500

100+ parts

-

1k+ parts

-

10k+ parts

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411

$25.500

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Kepictronics

USA . 4,500 parts In-Stock

1+ parts

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100+ parts

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4,500

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Corphita

USA . 3,222 parts In-Stock

1+ parts

-

100+ parts

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3,222

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Northwest PG Solutions

USA . 1,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.865

10k+ parts

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1,337

-

-

$4.865

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Parana Technologies

USA . 463 parts In-Stock

1+ parts

-

100+ parts

$16.214

1k+ parts

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10k+ parts

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463

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$16.214

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Overview

Elevate your designs with the 74ALVCH16245TTR from STMicroelectronics, a premier choice in bus drivers and transceivers. Renowned for quality and innovation, STMicroelectronics delivers exceptional performance that enhances signal integrity while minimizing delays. Ideal for automotive, industrial, and communication applications, this robust solution ensures reliability in demanding environments. Experience unmatched value, efficiency, and versatility with every connection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 3 ns

A low propagation delay indicates fast signal switching, enhancing overall performance in high-speed applications.

Surface Mount: YES

Surface mounting facilitates easy integration onto circuit boards and contributes to smaller form factors in modern electronic designs.

No. of Functions: 2

Having multiple functions allows for versatile applications, making this product suitable for complex circuit designs.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space usage on PCBs, optimizing layout design and arrangement.

No. of Bits: 8

Support for 8 bits provides a balance between performance and resource usage, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage allows for operation within common power supply ranges, enhancing compatibility with existing systems.

Load Capacitance (CL): 50 pF

A low load capacitance ensures minimal signal loss, making this device ideal for high-frequency applications.

Power Supplies (V): 3.3

The compatibility with 3.3 V power supplies ensures energy efficiency and is widely used in many modern digital circuits.

No. of Terminals: 48

A relatively high number of terminals offers more connection options, catering to complex circuit needs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for space-constrained designs, making this product suitable for compact electronic devices.

Maximum I (ol): 24 Amp

High output capability enhances the device's performance in demanding applications, such as power drivers.

Propagation Delay (tpd): 6 ns

A propagation delay of 6 ns signifies quick response times, vital for maintaining high-speed data integrity.

Maximum Operating Temperature: 125 °C

The high operational temperature tolerance means this product can function in harsh conditions, extending its application range.

Output Characteristics: 3-STATE

3-state output allows for efficient bus communication, enabling multiple devices to operate effectively on the same bus.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes this product suitable for use in extreme environments, particularly in military or aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finish reduces oxidation and enhances conductivity, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout, making it easier to work with in various design configurations.

No. of Ports: 2

With 2 ports, this product can facilitate bidirectional communication, increasing its versatility in applications.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact and low-profile design, advantageous for space-limited scenarios.

Width: 6.1 mm

A narrow width allows for denser packings of components on the PCB, optimizing space and enhancing layout efficiency.

Output Polarity: TRUE

True output polarity means the device operates in a predictable manner, simplifying integration into control systems.

Minimum Supply Voltage (Vsup): 1.65 V

The ability to operate at a minimum supply voltage of 1.65 V enhances the product's usability in low-power applications.

Peak Reflow Temperature °C: 260

This high reflow temperature capability allows for compatibility with various soldering processes, improving manufacturing flexibility.

Length: 12.5 mm

A moderate length means this part can fit well within standard spacing in PCB designs while maintaining high performance.

Temperature Grade: MILITARY

The military temperature grade indicates robustness for extreme conditions, appealing to defense and aerospace sectors.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this a reliable choice for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering, improving assembly processes and enhancing connection reliability.

Packing Method: TR

TR packing method ensures efficient handling and storage, simplifying logistics and distribution.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact designs, supporting modern miniaturized equipment.

Count Direction: BIDIRECTIONAL

Bidirectional count direction supports flexible data and signal management in various applications.

Control Type: COMMON CONTROL

The common control design simplifies integration into larger systems, enhancing usability across numerous applications.

Maximum Supply Voltage (Vsup): 3.6 V

The capacity to support up to 3.6 V allows for versatility in power supply design and ensures compatibility with numerous circuits.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74ALVCH16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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