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74ACT32TTR

STMicroelectronics

74ACT32TTR by STMicroelectronics

74ACT32TTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 10 ns and operates at a nominal voltage of 5V. It features four functions with dual inputs, ideal for compact electronic applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,978 parts In-Stock

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8,978

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Digiode

USA . 4,962 parts In-Stock

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4,962

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J2 Sourcing AB

Sweden . 2,407 parts In-Stock

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Anansix

USA . 2,284 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 336 parts In-Stock

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$7.840

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336

$7.840

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AZTECH Wire

Italy . 193 parts In-Stock

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$11.530

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193

$11.530

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

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$26.746

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$24.072

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2,292

$26.746

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$24.072

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

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$48.000

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$48.000

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MKK Technologies

India . 1,810 parts In-Stock

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$50.295

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DigiPath Technology Company

USA . 1,810 parts In-Stock

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$50.295

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$50.295

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QUARKTWIN TECHNOLOGY LTD

USA . 9,897 parts In-Stock

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Corphita

USA . 2,567 parts In-Stock

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Parana Technologies

USA . 1,583 parts In-Stock

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$31.979

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Northwest PG Solutions

USA . 1,243 parts In-Stock

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$4.626

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Native Components

USA . 279 parts In-Stock

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$4.578

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$4.578

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Overview

Unlock innovation with the 74ACT32TTR from STMicroelectronics, a top-tier solution in logic gates that enhances your designs with precision and reliability. Known for their exceptional quality, STMicroelectronics delivers unmatched performance, ensuring seamless integration in a variety of applications—from telecommunications to consumer electronics. Experience faster response times and low power consumption, making it an ideal choice for modern engineering needs. Elevate your projects with this robust component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 10 ns

A low propagation delay ensures fast switching speeds, improving the overall performance and efficiency in high-speed applications.

Surface Mount: YES

Being a surface mount device allows for compact designs and reduces the footprint on PCB, making it ideal for modern electronics.

No. of Functions: 4

With four functions, this product provides versatility, allowing it to serve multiple purposes in one package.

No. of Inputs: 2

Having two inputs makes it adaptable for various logical operations, giving designers flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs and facilitates easier handling and assembly.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard for numerous applications, ensuring compatibility with many systems.

Load Capacitance (CL): 50 pF

A low load capacitance helps in maintaining high-speed operation and reducing signal delay, which is ideal for high-performance circuits.

Power Supplies (V): 5

Supporting 5V power supplies makes this product suitable for integration into standard digital devices.

No. of Terminals: 14

With 14 terminals, this chip provides ample connectivity options for various configurations in circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style aids in effective space management on PCBs, making it advantageous for compact electronic designs.

Maximum I (ol): 24 Amp

A high output current capacity signifies the ability to drive more substantial loads, enhancing the product’s performance in demanding applications.

Propagation Delay (tpd): 10 ns

Reiterating its low propagation delay, this feature supports fast operational speeds, making it suitable for quick response applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates robustness and reliability in extreme conditions, ideal for military and industrial applications.

Minimum Operating Temperature: -55 °C

Extremely low minimum operating temperature ensures functionality in harsh environments, making it versatile for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The quality terminal finish promotes excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB design and makes the device easier to solder and integrate.

Maximum Seated Height: 1.1 mm

A low seated height allows for slimmer overall designs, facilitating the creation of compact electronic systems.

Width: 4.4 mm

A narrow width enables more efficient space management on PCBs, which is essential for modern compact designs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows for operation even in slightly lower power environments, increasing design flexibility.

Length: 5 mm

The compact length of the component makes it suitable for space-constrained applications, maximizing design efficiency.

Temperature Grade: MILITARY

The military-grade temperature classification ensures enhanced reliability and performance in extreme and demanding environments.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making this product ideal for battery-operated and sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form aids in easy soldering and effective mounting on PCBs, ensuring reliable connections.

Packing Method: TR

The tape and reel packing method simplifies automated assembly and handling, increasing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact layout designs while maintaining manufacturability and performance standards.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage capability of 5.5V provides a margin for various applications, enhancing the product's versatility.

Technical Specifications

Logic Gates 74ACT32TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74ACT32TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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