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74AC541TTR

STMicroelectronics

74AC541TTR by STMicroelectronics

74AC541TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 9 ns, operating at a nominal voltage of 3.3V. It features a compact SOIC package and supports military-grade temperatures from -55 °C to 125°C. Ideal for high-speed data transmission in communication systems, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,021 parts In-Stock

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8,021

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Pegasus Components GmbH

Germany . 5,000 parts In-Stock

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5,000

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Digiode

USA . 3,059 parts In-Stock

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3,059

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Anansix

USA . 1,256 parts In-Stock

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1,256

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LIBRA Elektronik GmbH

Germany . 296 parts In-Stock

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296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 706 parts In-Stock

1+ parts

$0.034

100+ parts

-

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$0.033

706

$0.034

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-

$0.033

Andel Nordic

Denmark . 4,546 parts In-Stock

1+ parts

$2.487

100+ parts

-

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$2.388

10k+ parts

$2.388

4,546

$2.487

-

$2.388

$2.388

Microchip USA

USA . 425 parts In-Stock

1+ parts

$7.450

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425

$7.450

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$9.541

100+ parts

$8.682

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$7.824

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-

500

$9.541

$8.682

$7.824

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Corohmni

South Africa . 154 parts In-Stock

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$15.679

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154

$15.679

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AZTECH Wire

Italy . 823 parts In-Stock

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$18.920

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823

$18.920

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IDEA Electronic Components Group

UK . 48 parts In-Stock

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$25.177

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$22.659

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48

$25.177

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$22.659

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MKK Technologies

India . 1,232 parts In-Stock

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$47.343

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$47.343

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DigiPath Technology Company

USA . 1,232 parts In-Stock

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$47.343

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1,232

$47.343

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Component Stockers USA

USA . 745 parts In-Stock

1+ parts

$99.990

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745

$99.990

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Parana Technologies

USA . 2,312 parts In-Stock

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$30.103

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2,312

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$30.103

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Corphita

USA . 1,395 parts In-Stock

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1,395

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Northwest PG Solutions

USA . 826 parts In-Stock

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826

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Cyclops Electronics Ltd (Excess)

UK . 40 parts In-Stock

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40

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Overview

Unlock the power of seamless connectivity with the 74AC541TTR from STMicroelectronics. Renowned for its exceptional quality and reliability, this advanced bus driver and transceiver enhances data integrity while simplifying design complexities. Ideal for high-performance applications in telecommunications, automotive, and industrial sectors, it delivers robust performance with ultra-low propagation delay, ensuring your systems operate at peak efficiency. Experience unparalleled value and innovation from a trusted leader in semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances reliability and resistance to environmental factors, making it suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay ensures faster signal transitions, which is crucial for high-speed data communication.

Surface Mount: YES

The surface mount technology allows for compact designs and efficient use of PCB space, essential for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of integration into designs, providing an organized layout on PCBs.

No. of Bits: 8

An 8-bit driver provides flexible data handling, enabling efficient communication for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes it compatible with a wide range of low-power digital circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures adaptability to various loading conditions, making the device versatile for different uses.

Power Supplies (V): 3.3/5

The dual power supply capability enables flexibility in system design and integration with existing components.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options, facilitating complex circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style minimizes space on the PCB and accommodates high-density applications, making it ideal for modern electronics.

Maximum I (ol): 12 Amp

A maximum output current of 12A indicates robust performance in driving loads, suitable for demanding applications.

Propagation Delay (tpd): 9 ns

Reiterating the low propagation delay contributes to efficient and fast signal processing capabilities.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to function reliably in harsh environments.

Output Characteristics: 3-STATE

3-state output characteristics enable greater control over signal pathways, enhancing circuit design flexibility.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature expands the product's usability in extreme conditions, suitable for aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures excellent conductivity and corrosion resistance, promoting long-term reliability.

Terminal Position: DUAL

Dual terminal positioning provides ease of mounting and accessibility, simplifying the design and assembly process.

No. of Ports: 2

Having two ports enhances connectivity and allows for dual-channel communication, increasing the versatility of the device.

Maximum Seated Height: 1.2 mm

A low seated height facilitates integration into compact spaces, making it ideal for space-constrained designs.

Width: 4.4 mm

A narrow width allows for higher density layouts on PCBs, which is important for miniaturized electronic designs.

Output Polarity: TRUE

The true output polarity simplifies the design of signal interfaces while maintaining compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V allows it to operate in low-power conditions, making it ideal for battery-powered devices.

Length: 6.5 mm

The compact length supports efficient space management on PCBs, essential for modern electronic devices.

Temperature Grade: MILITARY

The military-grade temperature resilience ensures reliability and performance in critical and demanding applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and provides strong mechanical support, enhancing durability.

Packing Method: TR

The tape and reel packing method facilitates automated assembly processes, increasing efficiency in manufacturing.

Terminal Pitch: 0.65 mm

A tight terminal pitch allows for higher density layouts, supporting compact and advanced electronic designs.

Control Type: ENABLE LOW

The low-enable control type simplifies control logic in digital circuits, enhancing design efficiency.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V provides flexibility in power supply design, accommodating a range of devices.

Technical Specifications

Bus Driver & Transceivers 74AC541TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74AC541TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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