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74AC244TTR

STMicroelectronics

74AC244TTR by STMicroelectronics

74AC244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 10 ns, supporting dual 4-bit functions. It operates at supply voltages from 2V to 6V and features a compact SOIC package, ideal for high-speed data transmission in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,639 parts In-Stock

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3,639

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Digiode

USA . 1,895 parts In-Stock

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Anansix

USA . 1,262 parts In-Stock

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1,262

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Distributors (Availability)

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Native Components

USA . 827 parts In-Stock

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$0.558

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827

$0.558

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Northwest PG Solutions

USA . 335 parts In-Stock

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$0.614

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335

$0.614

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Andel Nordic

Denmark . 530 parts In-Stock

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$3.228

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$3.099

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$3.099

530

$3.228

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$3.099

$3.099

Microchip USA

USA . 172 parts In-Stock

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$10.517

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172

$10.517

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AZTECH Wire

Italy . 1,043 parts In-Stock

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$17.120

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$17.120

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IDEA Electronic Components Group

UK . 2,006 parts In-Stock

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$19.508

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$17.557

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2,006

$19.508

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$17.557

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MKK Technologies

India . 1,263 parts In-Stock

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$36.683

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$36.683

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DigiPath Technology Company

USA . 1,263 parts In-Stock

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$36.683

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1,263

$36.683

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Parana Technologies

USA . 1,280 parts In-Stock

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$23.324

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$23.324

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Corphita

USA . 129 parts In-Stock

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Overview

Elevate your designs with the 74AC244TTR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust bus driver and transceiver combines exceptional reliability with rapid data transmission, making it ideal for diverse applications—from consumer electronics to industrial systems. With its compact profile and high-performance capabilities, you’ll enjoy enhanced efficiency, reduced power consumption, and seamless integration into your projects, ensuring lasting value and performance excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliability and performance in various environments.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay enhances speed and efficiency, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

No. of Functions: 2

Dual functionality maximizes utility and cost-effectiveness by providing more features in a single device.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient, optimizing layout on the PCB.

No. of Bits: 4

A 4-bit configuration supports efficient data handling in applications requiring moderate data width.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at 3.3V, which is standard for many logic devices, ensuring compatibility with a wide range of systems.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, providing flexibility for use in varying device environments.

No. of Terminals: 20

A 20-terminal configuration offers ample connectivity options for complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and shrink pitch design enables easy placement on densely populated circuit boards.

Maximum I (ol): 12 Amp

High output current capacity allows it to drive larger loads, making it suitable for power-intensive applications.

Propagation Delay (tpd): 12.5 ns

Competitive propagation delay ensures rapid signal transitions, improving overall speed in data processing.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for demanding industrial applications.

Output Characteristics: 3-STATE

3-state outputs provide flexibility for bus applications, allowing multiple devices to share the same communication lines.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning optimizes space and layout on circuit boards, enabling more compact designs.

No. of Ports: 2

Having two ports allows for dual data lines, making it easier to manage connections in complex circuits.

Maximum Seated Height: 1.2 mm

The low seated height accommodates tight spaces in small electronic devices.

Width: 4.4 mm

Compact width fits well in space-constrained applications without compromising performance.

Output Polarity: TRUE

True output polarity enhances signal integrity in digital systems.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for energy-efficient operation across various devices.

Length: 6.5 mm

Short length contributes to a compact footprint, facilitating minimal board space usage.

Temperature Grade: MILITARY

MIL-grade temperature classification ensures robustness and reliability in critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration capabilities, ideal for modern designs.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and enhance reliability in board assembly.

Packing Method: TR

Tape and reel packaging simplifies automated assembly and improves handling for bulk applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables more components to be placed on the PCB, maximizing functionality.

Control Type: ENABLE LOW

Low-enable control provides easy interfacing with microcontrollers and other digital logic devices.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V allows for flexibility in power source selection across different applications.

Technical Specifications

Bus Driver & Transceivers 74AC244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74AC244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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