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H5AN8G6NAFR-UHC

Sk Hynix

H5AN8G6NAFR-UHC by Sk Hynix

DDR4 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Sensible Micro Corp

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Alle Elektronik GmbH

Germany . 5,462 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,462

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S.R.D Solutions

India . 100 parts In-Stock

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100

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Technical Specifications

DRAM H5AN8G6NAFR-UHC attributes and parameters. Explore more DRAM devices from Sk Hynix

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B96

Length:

13 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

536870912 words

No. of Words Code:

512M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

H5AN8G6NAFR-UHC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Sk Hynix

A Solution Provider Leading the Global ICT Ecosystem With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees. SK hynix is committed to becoming a solution provider, which leads the global ICT ecosystem through paradigm-shifting hyper collaboration with our global partners. Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in search of more social value and a healthier governance structure. SK hynix will rise to become a “Global Top-Tier Technology Company”, which contributes to humanity and society.

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