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NMC27C64QM250

Rochester Electronics

NMC27C64QM250 by Rochester Electronics

UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 223 parts In-Stock

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223

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Anansix

USA . 120 parts In-Stock

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120

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Digiode

USA . 104 parts In-Stock

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104

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 119 parts In-Stock

1+ parts

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119

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Assy Fe

Spain . 2 parts In-Stock

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2

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Technical Specifications

EPROM NMC27C64QM250 attributes and parameters. Explore more EPROM devices from Rochester Electronics

Specs

Maximum Access Time:

250 ns

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

5.72 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

NMC27C64QM250 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

NSN

5962-01-363-5457, 5962013635457

NIIN

013635457

Manufacturer Highlights

Rochester Electronics

For over 40 years Rochester's growing supplier authorizations enable us to provide the world's largest source of semiconductors. In partnership with over 70 leading component manufacturers, we provide our valued customers with a continuous source of critical semiconductors. Today the Rochester Semiconductor Lifecycle Solution™ offers the world’s largest range of semiconductors with over 15 billion finished devices in stock, combined with extensive manufacturing capabilities from the world's largest die bank at over 12 Billion. Rochester’s growing product and service portfolio continues to provide an authorized source of supply to customers around the world directly, in partnership with our authorized distribution network and through leading-edge e-commerce platforms.

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