Loading...

HD6417709SBP100V

Renesas Technology

HD6417709SBP100V by Renesas Technology

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 240; Package Code: FBGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Microprocessors HD6417709SBP100V attributes and parameters. Explore more Microprocessors devices from Renesas Technology

Specs

Bit Size:

32

JESD-30 Code:

S-PBGA-B240

No. of Terminals:

240

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.7,3.3

Qualification:

Not Qualified

Speed:

100 rpm

Sub-Category:

Microprocessors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

HD6417709SBP100V Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Renesas Technology

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.