Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G54; Parallel or Serial: PARALLEL;
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$14.120
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$55.093
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$424.840
MRAMs M3008316035NX0ITBR attributes and parameters. Explore more MRAMs devices from Renesas Electronics
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M3008316035NX0ITBR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Obsolescence/ EOL - Mult DEV EOL 01/Dec/2023 Retraction of PLC230011-A1
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
LM2931Z-5.0G
Onsemi
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
EU2B-YS3303C
Idec
ROTARY SWITCH;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
BAV99
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
LM107H/883
Texas Instruments
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
Formosa Microsemi
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MR2S08ATS35C
NXP Semiconductors
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL;
M3016316045NX0PTBY
Renesas Electronics
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.194 mm; Organization: 1MX16;
M3008316035NX0PTBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Width: 16; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
M3004316035NX0ITAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Memory Density: 4194304 bit;
M3004316035NX0ITBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit; Minimum Standby Voltage: 2.7 V;
MR0S8AVYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
MR1S8AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
MR4S8AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words: 2097152 words;
EM064LXQADG13CS1R
Everspin Technologies
STT MRAM;
M3004316035NX0PTBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Width: 16; Terminal Position: DUAL;
MR1A08AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Standby Voltage: 3 V;
MR2S08ACYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
MR0S08AVYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;
M3008316035NX0ITBR
MR2S8AVYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
M3032316045NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Minimum Data Retention Time: 10; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
M3016316035NX0PTBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns; Organization: 1MX16;
MR2S08AYS35
MR2S8AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
M3016316035NX0ITBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE; Moisture Sensitivity Level (MSL): 3;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M3004316045NX0PBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Terminal Form: BALL; No. of Words Code: 256K;
M3004316035NX0PTBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Terminal Form: GULL WING;
M3004316035NX0ITBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; No. of Words Code: 256K;
M3004316045NX0ITBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 10; Memory Width: 16;
M3004316045NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; No. of Words Code: 256K; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
M3004316035NX0PTAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2.7 V; No. of Functions: 1;
M3004316045NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; No. of Words Code: 256K;
M3004316035NX0IBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
M3004316045NX0ITAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit; JESD-609 Code: e3;
M3004316045NX0IBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Organization: 256KX16; Minimum Data Retention Time: 10;
M3004316035NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS; Endurance: 100000000000000 Write/Erase Cycles;
M3004316045NX0ITBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; No. of Words: 262144 words; Package Equivalence Code: TSOP54,.46,32;
M3004316035NX0PTAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm; Technology: CMOS;
M3004316035NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Package Equivalence Code: BGA48,6X8,30;
M3004316035NX0ITAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; No. of Words: 262144 words; Moisture Sensitivity Level (MSL): 3;
M3004316035NX0PBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Memory Density: 4194304 bit; Maximum Operating Temperature: 105 Cel;
M3004316045NX0ITAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Terminal Finish: TIN;
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