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HD6417705BP133BV

Renesas Electronics

HD6417705BP133BV by Renesas Electronics

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: FBGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 705 parts In-Stock

1+ parts

$5.940

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$5.940

-

-

-

Northwest PG Solutions

USA . 1,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.821

10k+ parts

-

1,256

-

-

$5.821

-

Technical Specifications

Microprocessors HD6417705BP133BV attributes and parameters. Explore more Microprocessors devices from Renesas Electronics

Specs

Bit Size:

32

JESD-30 Code:

S-PBGA-B208

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Speed:

133 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

200 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

HD6417705BP133BV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Renesas Electronics

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