Loading...

HYB25D128323C-3

Qimonda Ag

HYB25D128323C-3 by Qimonda Ag

DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: FBGA; Refresh Cycles: 4096; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

988

-

-

-

-

Vyrian

USA . 62 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

62

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 832 parts In-Stock

1+ parts

$4.327

100+ parts

$4.154

1k+ parts

$3.981

10k+ parts

-

832

$4.327

$4.154

$3.981

-

Corphita

USA . 948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

948

-

-

-

-

Technical Specifications

DRAM HYB25D128323C-3 attributes and parameters. Explore more DRAM devices from Qimonda Ag

Specs

Maximum Access Time:

.5 ns

Maximum Clock Frequency (fCLK):

333 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

2,4,8

JESD-30 Code:

S-PBGA-B144

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

32

No. of Terminals:

144

No. of Words:

4194304 words

No. of Words Code:

4M

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4MX32

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

2.5

Qualification:

Not Qualified

Refresh Cycles:

Sequential Burst Length:

2,4,8

Maximum Standby Current:

.065 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

430 mA

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

HYB25D128323C-3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Qimonda Ag

Qimonda AG was a German memory company split out of Infineon Technologies on 1 May 2006 to form at the time the second largest DRAM company worldwide, according to the industry research firm Gartner Dataquest. It was a patent licensing firm until Micron and others purchased its patents.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.