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SCC68070CAB

Philips Semiconductors

SCC68070CAB by Philips Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 120; Package Code: QFP; Package Style (Meter): FLATPACK;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Microprocessors SCC68070CAB attributes and parameters. Explore more Microprocessors devices from Philips Semiconductors

Specs

Bit Size:

32

JESD-609 Code:

e0

No. of Terminals:

120

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP120(UNSPEC)

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Speed:

10 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

95 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SCC68070CAB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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