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R3710-CEAA-E1

Onsemi

R3710-CEAA-E1 by Onsemi

R3710-CEAA-E1 by Onsemi is a 25-terminal DSP chip with a clock frequency of 4.218 MHz, suitable for commercial applications. It operates b/w 0 to 40 °C, featuring low power mode and CMOS technology. The package style is chip carrier with dimensions of 3.12mm x 4.57mm x 1.52mm, making it ideal for surface mount designs.

Median Price

$37.770

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 25 parts In-Stock

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$37.770

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25

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$37.770

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Verical

USA . 25 parts In-Stock

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$37.770

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25

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$37.770

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Chip1Stop

Japan . 25 parts In-Stock

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$21.900

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25

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$21.900

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DigiKey

USA . 15 parts In-Stock

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Rochester

USA . 8 parts In-Stock

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$41.140

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$36.810

10k+ parts

$34.650

8

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$41.140

$36.810

$34.650

Distributors (In-Stock)

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Digiode

USA . 782 parts In-Stock

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$43.548

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Vyrian

USA . 3,990 parts In-Stock

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3,990

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Distributors (Availability)

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Corohmni

South Africa . 431 parts In-Stock

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$20.190

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431

$20.190

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Corphita

USA . 2,409 parts In-Stock

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$41.256

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Component Stockers USA

USA . 50 parts In-Stock

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$46.530

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$46.530

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QUARKTWIN TECHNOLOGY LTD

USA . 17,471 parts In-Stock

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TANS Electronics

Latvia . 7,390 parts In-Stock

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SupplyDigital Components

Austria . 7,335 parts In-Stock

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Kulean Microsystems

USA . 6,990 parts In-Stock

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6,990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,677 parts In-Stock

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Problanco Electronics

Mexico . 1,812 parts In-Stock

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Continental Prestige Electronics

USA . 15 parts In-Stock

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UHIMA Technologies

Türkiye . 14 parts In-Stock

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14

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Overview

The R3710-CEAA-E1 by Onsemi is a top-of-the-line Digital Signal Processor that guarantees high-quality performance and reliability. Onsemi, known for its cutting-edge technology and innovation, has designed this product to cater to a variety of applications in the digital signal processing category. With its advanced features and durable construction, this chip carrier package offers unmatched value, benefits, and advantages to customers seeking superior processing power and efficiency. Upgrade your projects with the R3710-CEAA-E1 and experience the difference in performance and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly processes, saving time and effort during manufacturing.

Maximum Clock Frequency: 4.218 MHz

With a high maximum clock frequency, this DSP can handle complex signal processing tasks quickly and efficiently.

Technology: CMOS

CMOS technology enables low power consumption and high performance, making the DSP energy-efficient and reliable.

Nominal Supply Voltage: 1.25 V

Operating at a low nominal supply voltage allows for energy savings and reduced heat generation, enhancing the product's overall efficiency.

Technical Specifications

Digital Signal Processors (DSPs) R3710-CEAA-E1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Onsemi

Specs

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

4.218 MHz

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PBCC-B25

Length:

4.57 mm

Low Power Mode:

YES

No. of Terminals:

25

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.52 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.12 mm

Peripheral IC Type:

Trade Compliance

R3710-CEAA-E1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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