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NZ8F7V5SMX2WT5G

Onsemi

NZ8F7V5SMX2WT5G by Onsemi

NZ8F7V5SMX2WT5G by Onsemi is a Zener diode with 4V reverse test voltage, 7.5V nominal reference voltage, and 2.27% max voltage tolerance. It is ideal for applications requiring precise voltage regulation in temperature ranges from -65 to 150 °C, with a small outline package suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 168,000 parts In-Stock

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USA . 168,000 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 1,086 parts In-Stock

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Problanco Electronics

Mexico . 4,032 parts In-Stock

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Kulean Microsystems

USA . 2,896 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 819 parts In-Stock

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UHIMA Technologies

Türkiye . 180 parts In-Stock

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SupplyDigital Components

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Corohmni

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Overview

Discover the NZ8F7V5SMX2WT5G by Onsemi, a top-quality Zener diode that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted industry leader, this diode is perfect for a variety of applications. With its low reverse current and high voltage tolerance, this diode ensures stable and efficient operation. Experience the benefits of this diode's superior quality and precision engineering, providing customers with peace of mind and confidence in their electronic projects. Choose the NZ8F7V5SMX2WT5G for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the zener diode lightweight and durable, suitable for a variety of applications.

Working Test Current: 5 mA

With a working test current of 5 mA, this zener diode can efficiently regulate voltage while ensuring minimal power consumption.

Surface Mount: YES

Being surface mountable, this zener diode offers easy and convenient installation on circuit boards.

Maximum Reverse Current: 0.5 uA

The low maximum reverse current of 0.5 uA indicates good reverse leakage characteristics, ensuring stability in voltage regulation.

Maximum Voltage Tolerance: 2.27 %

The tight maximum voltage tolerance of 2.27% provides accurate and consistent voltage regulation in various applications.

Maximum Power Dissipation: 0.25 W

With a maximum power dissipation of 0.25 W, this zener diode can handle moderate power levels without overheating.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows this zener diode to be used in a wide range of environments without performance degradation.

Nominal Reference Voltage: 7.5 V

The nominal reference voltage of 7.5 V indicates the precise voltage at which this zener diode will begin to conduct, making it ideal for voltage regulation applications.

Technical Specifications

Zener Diodes NZ8F7V5SMX2WT5G attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

30 ohm

Maximum Forward Voltage (VF):

.9 V

JESD-30 Code:

R-PDSO-N2

JESD-609 Code:

e4

Maximum Knee Impedance:

60 ohm

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Nominal Reference Voltage:

7.5 V

Maximum Reverse Current:

.5 uA

Reverse Test Voltage:

4 V

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2.27 %

Working Test Current:

5 mA

Trade Compliance

NZ8F7V5SMX2WT5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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