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NZ8F24VSMX2WT5G

Onsemi

NZ8F24VSMX2WT5G by Onsemi

NZ8F24VSMX2WT5G by Onsemi is a Zener diode with 24V nominal reference voltage, 18.9V reverse test voltage, and 2.29% max voltage tolerance. It is ideal for applications requiring precise voltage regulation in electronic circuits due to its low dynamic impedance and unidirectional polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,652 parts In-Stock

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Digiode

USA . 1,568 parts In-Stock

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AZTECH Wire

Italy . 378 parts In-Stock

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$18.350

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Component Stockers USA

USA . 764 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,152 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Problanco Electronics

Mexico . 7,061 parts In-Stock

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SupplyDigital Components

Austria . 2,430 parts In-Stock

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Kulean Microsystems

USA . 1,245 parts In-Stock

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Corphita

USA . 1,187 parts In-Stock

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UHIMA Technologies

Türkiye . 316 parts In-Stock

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Corohmni

South Africa . 283 parts In-Stock

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Overview

Discover the exceptional NZ8F24VSMX2WT5G Zener Diode by Onsemi, a top-quality component designed to provide precise voltage regulation for a wide range of applications. Manufactured by the reputable Onsemi brand, this Zener diode offers unparalleled reliability and performance. Whether you are in the automotive, telecommunications, or industrial sector, this product ensures stable and efficient operation. Experience the value and benefits of using the NZ8F24VSMX2WT5G Zener diode - it's the smart choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the diode, ensuring durability and longevity.

Working Test Current: 5 mA

Allows for efficient operation within the specified current range.

Maximum Reverse Current: 0.1 uA

Ensures low leakage current, leading to better performance and accuracy.

Maximum Reverse Test Voltage: 18.9 V

Safely handles reverse voltage to protect the circuit from damage.

Maximum Voltage Tolerance: 2.29 %

Offers precise voltage regulation for consistent performance.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for a wide range of applications.

Maximum Power Dissipation: 0.25 W

Efficiently dissipates heat to prevent overheating and ensure reliability.

Diode Type: ZENER DIODE

Specifically designed as a Zener diode for voltage regulation and protection.

Nominal Reference Voltage: 24 V

Provides a stable reference voltage for accurate circuit operation.

Technology: ZENER

Utilizes Zener technology for precision voltage regulation and protection.

Technical Specifications

Zener Diodes NZ8F24VSMX2WT5G attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

70 ohm

Maximum Forward Voltage (VF):

.9 V

JESD-30 Code:

R-PDSO-N2

JESD-609 Code:

e4

Maximum Knee Impedance:

120 ohm

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Nominal Reference Voltage:

24 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

18.9 V

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2.29 %

Working Test Current:

5 mA

Trade Compliance

NZ8F24VSMX2WT5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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