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NVB6412ANT4G

Onsemi

NVB6412ANT4G by Onsemi

NVB6412ANT4G by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 240A IDM, and 0.0182 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

$0.955

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 548 parts In-Stock

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$0.760

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Chip1Stop

Japan . 548 parts In-Stock

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$1.150

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$0.882

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Verical

USA . 548 parts In-Stock

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Digiode

USA . 2,392 parts In-Stock

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$0.995

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Vyrian

USA . 12,805 parts In-Stock

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Corohmni

South Africa . 414 parts In-Stock

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$0.882

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Corphita

USA . 1,285 parts In-Stock

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$0.942

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AZTECH Wire

Italy . 928 parts In-Stock

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$17.480

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,199 parts In-Stock

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Kulean Microsystems

USA . 7,504 parts In-Stock

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TANS Electronics

Latvia . 5,848 parts In-Stock

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Problanco Electronics

Mexico . 5,104 parts In-Stock

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SupplyDigital Components

Austria . 3,836 parts In-Stock

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UHIMA Technologies

Türkiye . 332 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the NVB6412ANT4G by Onsemi. This top-of-the-line Power Field Effect Transistor (FET) is designed to deliver unparalleled performance and reliability, thanks to Onsemi's renowned quality standards. Ideal for a wide range of applications, this N-CHANNEL FET offers customers exceptional value, efficiency, and durability. Say goodbye to compromises and embrace cutting-edge technology with the NVB6412ANT4G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the circuit, improving overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by already incorporating a diode within the transistor, reducing the need for additional components.

Surface Mount: YES

Facilitates easy installation on a circuit board, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 100 V

Ensures reliability and safety in high voltage applications.

Maximum Pulsed Drain Current (IDM): 240 A

Capable of handling high current surges, making it suitable for demanding power applications.

Maximum Power Dissipation (Abs): 167 W

Efficiently dissipates heat generated during operation, preventing overheating and protecting the transistor.

Maximum Operating Temperature: 175 °C

Can withstand high operating temperatures, ideal for use in various environmental conditions.

Maximum Drain-Source On Resistance: 0.0182 ohm

Low on-resistance results in minimal power loss and improved efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NVB6412ANT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.0182 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVB6412ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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