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NVB6413ANT4G

Onsemi

NVB6413ANT4G by Onsemi

NVB6413ANT4G by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 178A IDM. Ideal for applications requiring high power dissipation up to 136W, such as automotive systems due to AEC-Q101 standard compliance.

Median Price

$1.252

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

266

-

$1.230

$1.020

$0.910

Verical

USA . 266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.275

10k+ parts

$1.138

266

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-

$1.275

$1.138

Distributors (In-Stock)

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Digiode

USA . 177 parts In-Stock

1+ parts

$0.960

100+ parts

-

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177

$0.960

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Chip Stock

USA . 43,000 parts In-Stock

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43,000

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Vyrian

USA . 4,745 parts In-Stock

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4,745

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Distributors (Availability)

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Corphita

USA . 1,794 parts In-Stock

1+ parts

$0.909

100+ parts

-

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-

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1,794

$0.909

-

-

-

Corohmni

South Africa . 391 parts In-Stock

1+ parts

$1.010

100+ parts

-

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391

$1.010

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Component Stockers USA

USA . 183 parts In-Stock

1+ parts

$1.040

100+ parts

$0.980

1k+ parts

-

10k+ parts

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183

$1.040

$0.980

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AZTECH Wire

Italy . 700 parts In-Stock

1+ parts

$17.190

100+ parts

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700

$17.190

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TANS Electronics

Latvia . 4,663 parts In-Stock

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4,663

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SupplyDigital Components

Austria . 3,451 parts In-Stock

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3,451

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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960

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Kulean Microsystems

USA . 916 parts In-Stock

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916

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Problanco Electronics

Mexico . 677 parts In-Stock

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677

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Overview

Discover the power of the NVB6413ANT4G by Onsemi, a top-quality Power Field Effect Transistor that delivers unrivaled performance and reliability. Manufactured by Onsemi, a renowned leader in semiconductor technology, this N-CHANNEL FET is designed for applications requiring high efficiency and robustness. With a built-in diode and impressive specifications, this transistor offers exceptional value to customers seeking optimal performance in their electronic devices. Experience the innovation and quality that only Onsemi can provide with the NVB6413ANT4G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides good insulation and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current-carrying capabilities compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient control of current flow and helps protect the circuit from reverse polarity and voltage spikes.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into compact electronic designs.

Minimum DS Breakdown Voltage: 100 V

A high breakdown voltage ensures more robust and reliable performance in high-voltage applications.

Maximum Pulsed Drain Current (IDM): 178 A

The high pulsed drain current rating allows the FET to handle sudden spikes in current without damage.

Maximum Power Dissipation (Abs): 136 W

The high power dissipation rating means the FET can handle high power loads without overheating.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can be used in demanding environmental conditions.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its high efficiency and reliability in electronic devices.

Technical Specifications

Power Field Effect Transistors (FET) NVB6413ANT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

178 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVB6413ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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