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NTS2101PT1

Onsemi

NTS2101PT1 by Onsemi

NTS2101PT1 by Onsemi is a P-CHANNEL FET with 8V DS breakdown voltage and 3.7A max drain current, ideal for switching applications. It features a built-in diode, operates in enhancement mode, and has a max power dissipation of 0.96W. This small outline transistor has a 0.1 ohm on resistance and can withstand temperatures up to 150 °C.

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1k+

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Vyrian

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AZTECH Wire

Italy . 470 parts In-Stock

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Component Stockers USA

USA . 593 parts In-Stock

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$99.990

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RC Electronics

USA . 65,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

USA . 7,382 parts In-Stock

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SupplyDigital Components

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Germany . 6,084 parts In-Stock

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TANS Electronics

Latvia . 5,595 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 3,085 parts In-Stock

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Metaverse IC Inc.

Canada . 2,599 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NTS2101PT1 by Onsemi. Crafted with precision and innovation, this small signal field-effect transistor offers unparalleled quality and reliability. Its P-channel configuration and built-in diode make it ideal for switching applications, ensuring seamless performance. With a maximum drain current of 3.7A and a maximum power dissipation of 0.96W, this transistor delivers unmatched efficiency and durability. Experience the value and benefits of Onsemi's expertise in semiconductor technology with the NTS2101PT1, the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and can withstand high temperatures, making the transistor durable and reliable.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low conduction resistance and high input impedance, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse voltage, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast and efficient on/off switching capabilities.

Surface Mount: YES

Surface mount technology enables easy and compact installation of the transistor on circuit boards, saving space and assembly time.

Minimum DS Breakdown Voltage: 8 V

With a minimum breakdown voltage of 8V, this transistor is suitable for low voltage applications where reliable performance is crucial.

Maximum Drain Current (Abs) (ID): 3.7 A

The high maximum drain current rating of 3.7A allows the transistor to handle high current loads with ease, ensuring stable operation under varying conditions.

Maximum Power Dissipation (Abs): 0.96 W

The maximum power dissipation of 0.96W indicates the transistor's ability to handle power efficiently and prevent overheating during operation.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can operate in a wide range of environmental conditions without compromising performance.

Maximum Drain-Source On Resistance: 0.1 ohm

The low drain-source on resistance of 0.1 ohm reduces power loss and improves efficiency, making the transistor ideal for high-speed switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTS2101PT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (Abs) (ID):

3.7 A

Maximum Drain Current (ID):

1.4 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTS2101PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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