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NTP85N03G

Onsemi

NTP85N03G by Onsemi

NTP85N03G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 85A ID, and 0.0068 ohm RDS(ON). It is used for switching applications in enhancement mode with 45A IDM. The transistor operates at a max temperature of 150 °C and has a package style of Flange Mount.

Median Price

$0.592

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,415 parts In-Stock

1+ parts

-

100+ parts

$0.581

1k+ parts

$0.482

10k+ parts

$0.430

7,415

-

$0.581

$0.482

$0.430

Verical

USA . 7,415 parts In-Stock

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$0.603

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7,415

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$0.603

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Distributors (In-Stock)

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Digiode

USA . 1,281 parts In-Stock

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$0.453

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1,281

$0.453

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Vyrian

USA . 2,661 parts In-Stock

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2,661

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Connector Distribution Corp

USA . 430 parts In-Stock

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430

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Right Parts Inc.

USA . 428 parts In-Stock

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428

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Corphita

USA . 1,267 parts In-Stock

1+ parts

$0.429

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1,267

$0.429

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Corohmni

South Africa . 160 parts In-Stock

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$0.477

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160

$0.477

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AZTECH Wire

Italy . 784 parts In-Stock

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$9.990

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784

$9.990

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 7,549 parts In-Stock

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Continental Prestige Electronics

USA . 7,415 parts In-Stock

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$0.437

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7,415

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$0.437

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A-Z Elektronik GmbH

Germany . 5,970 parts In-Stock

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Problanco Electronics

Mexico . 4,190 parts In-Stock

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4,190

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Kulean Microsystems

USA . 3,699 parts In-Stock

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3,699

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SupplyDigital Components

Austria . 2,858 parts In-Stock

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2,858

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UHIMA Technologies

Türkiye . 20 parts In-Stock

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Perfect Parts

USA . 10 parts In-Stock

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10

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Overview

Experience the power of innovation with the NTP85N03G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that excel in a variety of applications. The NTP85N03G stands out with its high performance and reliability, offering customers unmatched value and benefits. Whether you're looking for efficient switching solutions or enhanced power management, this N-CHANNEL transistor with built-in diode is the perfect choice. Trust Onsemi to provide cutting-edge technology that meets all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making this product a reliable choice for switching applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage allows the FET to handle higher voltages, increasing its versatility and applicability in different circuits.

Maximum Pulsed Drain Current (IDM): 45 A

With a high pulsed drain current rating, this FET can handle temporary spikes in current without getting damaged, ensuring reliable operation.

Maximum Power Dissipation (Abs): 80 W

The high power dissipation rating indicates that this FET can handle significant power without overheating, making it suitable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption, making this FET an efficient choice for switching applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows this FET to perform reliably in various environments, ensuring consistent operation even under challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTP85N03G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

85 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.0068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP85N03G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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