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NTHC5513T1

Onsemi

NTHC5513T1 by Onsemi

NTHC5513T1 by Onsemi is a Power FET with N-CHANNEL and P-CHANNEL configurations, ideal for SWITCHING applications. Features include 20V DS Breakdown Voltage, 10A IDM, and 0.08 ohm RDS(on). With 2 elements in a RECTANGULAR package, it operates at up to 150 °C for various electronic designs.

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Lifecycle Status

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5

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1k+

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Chip Stock

USA . 19,500 parts In-Stock

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Vyrian

USA . 5,081 parts In-Stock

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Electronic Expediters

USA . 2,800 parts In-Stock

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Digiode

USA . 1,985 parts In-Stock

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Bisco

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AZTECH Wire

Italy . 1,101 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,245 parts In-Stock

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TANS Electronics

Latvia . 2,593 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 1,391 parts In-Stock

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Corohmni

South Africa . 458 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Overview

Discover the power and reliability of the NTHC5513T1 by Onsemi, a top-of-the-line Power Field Effect Transistor (FET) designed for switching applications. With separate N-CHANNEL and P-CHANNEL elements featuring a built-in diode, this transistor offers enhanced performance and efficiency. Perfect for a wide range of electronic devices, this transistor provides a minimum DS breakdown voltage of 20V and a maximum pulsing drain current of 10A, ensuring optimal functionality. Trust in Onsemi's superior manufacturing quality and innovative technology to deliver unmatched value and benefits to meet all your electronic needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel options allows for flexibility in designing circuits for different applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Separate configuration with built-in diode simplifies circuit design and enhances overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications ensuring reliable performance.

Surface Mount: YES

Easy to install and suitable for compact circuit designs.

Minimum DS Breakdown Voltage: 20 V

Provides a safe margin for voltage fluctuations in the system.

Package Shape: RECTANGULAR

Compact shape for efficient placement on PCBs.

Terminal Form: C BEND

Secure and reliable terminal connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and ease of use in circuits.

No. of Elements: 2

Two elements for increased functionality and versatile circuit design.

Maximum Pulsed Drain Current (IDM): 10 A

High current handling capacity for demanding applications.

Maximum Drain Current (Abs) (ID): 2.1 A

Sufficient current rating for many switching applications.

No. of Terminals: 8

Sufficient terminals for connections in complex circuits.

Maximum Power Dissipation (Abs): 1.1 W

Low power dissipation for efficient energy use.

Package Style (Meter): SMALL OUTLINE

Compact package style for space-saving designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Advanced technology offering high performance and reliability.

Maximum Operating Temperature: 150 °C

High operating temperature range allowing for use in various environments.

Transistor Element Material: SILICON

Silicon-based material for improved performance and durability.

Terminal Finish: TIN LEAD

Tin lead finish for secure and stable terminal connections.

Maximum Drain Current (ID): 3.1 A

Higher drain current rating for increased capability.

Maximum Drain-Source On Resistance: 0.08 ohm

Low on-resistance for efficient switching and reduced power loss.

Terminal Position: DUAL

Dual terminal position for flexible mounting options.

Peak Reflow Temperature °C: 235

High peak reflow temperature for reliable soldering during manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) NTHC5513T1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.1 A

Maximum Drain Current (ID):

3.1 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHC5513T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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