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NSR02100HT1G

Onsemi

NSR02100HT1G by Onsemi

NSR02100HT1G by Onsemi is a Schottky rectifier diode with 100V reverse test voltage, 0.95V max forward voltage, and 0.2A max output current. It is ideal for fast recovery applications due to its small outline package style and high operating temperature range (-55 to 150°C).

Median Price

$0.048

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 111,000 parts In-Stock

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$0.044

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$0.044

Verical

USA . 111,000 parts In-Stock

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$0.044

111,000

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$0.044

Rochester

USA . 70,585 parts In-Stock

1+ parts

-

100+ parts

$0.051

1k+ parts

$0.042

10k+ parts

$0.038

70,585

-

$0.051

$0.042

$0.038

Chip1Stop

Japan . 51,000 parts In-Stock

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$0.043

51,000

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$0.043

Farnell

UK . 5,900 parts In-Stock

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$0.056

10k+ parts

$0.040

5,900

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-

$0.056

$0.040

Element14

Singapore . 5,900 parts In-Stock

1+ parts

-

100+ parts

$0.168

1k+ parts

$0.101

10k+ parts

$0.071

5,900

-

$0.168

$0.101

$0.071

Distrelec

Netherlands . 2,830 parts In-Stock

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2,830

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Distributors (In-Stock)

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Greenchips

USA . 15,000 parts In-Stock

1+ parts

$0.033

100+ parts

$0.033

1k+ parts

$0.030

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$0.030

15,000

$0.033

$0.033

$0.030

$0.030

Flip Electronics

USA . 36,000 parts In-Stock

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$0.036

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36,000

$0.036

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Digiode

USA . 1,344 parts In-Stock

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$0.040

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1,344

$0.040

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Nova Conductors

Japan . 10 parts In-Stock

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$0.096

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10

$0.096

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Maritex

Poland . 1 parts In-Stock

1+ parts

$0.174

100+ parts

$0.120

1k+ parts

$0.078

10k+ parts

$0.066

1

$0.174

$0.120

$0.078

$0.066

NAC Semi

USA . 72,000 parts In-Stock

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$0.064

72,000

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Vyrian

USA . 53,636 parts In-Stock

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53,636

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SIE Connect GmbH - GreenChips

Germany . 15,000 parts In-Stock

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DigiKey Marketplace

USA . 12,000 parts In-Stock

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Chip Stock

USA . 10,390 parts In-Stock

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Bristol Electronics

USA . 2,153 parts In-Stock

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$0.300

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$0.120

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$0.300

$0.120

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Cyclops Electronics Ltd

UK . 2,105 parts In-Stock

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Speed Components Ltd

Israel . 1,166 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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1,000

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Sensible Micro Corp

USA . 657 parts In-Stock

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657

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Distributors (Availability)

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Corohmni

South Africa . 480 parts In-Stock

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$0.033

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480

$0.033

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Semicontronic

India . 107,696 parts In-Stock

1+ parts

$0.035

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$0.034

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$0.034

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107,696

$0.035

$0.034

$0.034

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Ampacity Inc.

Singapore . 54,081 parts In-Stock

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$0.035

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Corphita

USA . 2,493 parts In-Stock

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Aztec Data Supply Inc.

USA . 345 parts In-Stock

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$0.060

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345

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Argo Parts USA

USA . 802 parts In-Stock

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$0.096

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$0.093

802

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$0.093

Eastek

USA . 90,000 parts In-Stock

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$0.110

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Formix International (Excess)

India . 28,246 parts In-Stock

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28,246

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Continental Prestige Electronics

USA . 17,720 parts In-Stock

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$0.093

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$0.071

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$0.048

17,720

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$0.093

$0.071

$0.048

Infinite Electronics LLP (Excess)

. 11,859 parts In-Stock

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11,859

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Problanco Electronics

Mexico . 7,978 parts In-Stock

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TANS Electronics

Latvia . 6,772 parts In-Stock

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Lixinc

USA . 6,623 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,164 parts In-Stock

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SupplyDigital Components

Austria . 3,748 parts In-Stock

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Kulean Microsystems

USA . 274 parts In-Stock

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UHIMA Technologies

Türkiye . 157 parts In-Stock

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Overview

Enhance your electronics projects with the NSR02100HT1G by Onsemi, a top-quality Schottky rectifier diode that offers fast recovery and superior performance. Manufactured by Onsemi, a trusted leader in the industry, this diode is designed for maximum efficiency and reliability. Ideal for a wide range of applications, this diode is a must-have component for any electronics enthusiast or professional looking to take their projects to the next level. Experience the value and benefits of the NSR02100HT1G and unlock endless possibilities for your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the diode, making it suitable for various environments and applications.

Config: SINGLE

Single configuration simplifies installation and maintenance processes, making it user-friendly and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and improving overall product design.

Maximum Reverse Current: 0.15 uA

Low reverse current helps to conserve power and improve overall efficiency in various electronic circuits.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor that allows for easy integration into existing systems and designs.

Reverse Test Voltage: 100 V

High reverse test voltage capability ensures reliable performance and protection against voltage spikes or reverse currents.

No. of Terminals: 2

Having only two terminals simplifies the connection process and reduces the risk of wiring errors, making it ideal for DIY projects or prototyping.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact circuit designs, especially in portable or space-constrained applications.

Application: FAST RECOVERY

Fast recovery time ensures quick response and efficient operation, making it suitable for high-frequency circuits or applications that require rapid switching.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance allows for use in a wide range of temperature conditions without compromising performance or reliability.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable operation even in extreme cold environments, making it suitable for outdoor or industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring secure and long-lasting connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and layout, allowing for different connection configurations to meet specific requirements.

Maximum Power Dissipation: 0.2 W

Low power dissipation helps prevent overheating and extends the lifespan of the diode, ensuring long-term reliability and performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering process during assembly, reducing production time and cost.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures proper soldering and robust connection, especially in lead-free assembly processes.

Diode Type: RECTIFIER DIODE

Rectifier diode type allows for efficient conversion of AC to DC current, making it suitable for power supply circuits and rectification applications.

Maximum Forward Voltage (VF): 0.95 V

Low forward voltage drop reduces power loss and improves energy efficiency, making it ideal for low-power or battery-operated devices.

Maximum Output Current: 0.2 A

Moderate output current rating allows for reliable operation in a variety of low to medium power electronic circuits or devices.

Technology: SCHOTTKY

Schottky technology offers fast switching speed and low forward voltage drop, making it ideal for high-frequency applications or power rectification.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical support and easy soldering during assembly, ensuring reliable electrical connections.

Maximum Non Repetitive Peak Forward Current: 2 A

High non-repetitive peak forward current rating allows for reliable operation in circuits that experience occasional current surges or spikes.

Diode Element Material: SILICON

Silicon material offers good thermal stability and high reliability, ensuring consistent performance over a wide range of operating conditions.

Technical Specifications

Diodes & Rectifiers NSR02100HT1G attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Additional Features:

LOW LEAKAGE CURRENT

Application:

FAST RECOVERY

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.95 V

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

2 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.2 W

Maximum Reverse Current:

.15 uA

Reverse Test Voltage:

100 V

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NSR02100HT1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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