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NLV27WZ126USG

Onsemi

NLV27WZ126USG by Onsemi

NLV27WZ126USG by Onsemi is a Bus Driver & Transceiver with 4.8ns Propagation Delay, 2 Functions, and AEC-Q100 Screening Level. It operates at 5V nominal voltage and 3.3V power supplies, suitable for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$0.094

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 99,000 parts In-Stock

1+ parts

-

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$0.090

99,000

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$0.090

Chip1Stop

Japan . 99,000 parts In-Stock

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$0.090

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$0.090

Verical

USA . 24,000 parts In-Stock

1+ parts

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$0.097

24,000

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$0.097

DigiKey

USA . 9,000 parts In-Stock

1+ parts

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$0.210

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$0.210

Flip Electronics (Authorized)

USA . 5,875 parts In-Stock

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5,875

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Distributors (In-Stock)

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Vyrian

USA . 1,564 parts In-Stock

1+ parts

$0.090

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1,564

$0.090

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Flip Electronics

USA . 4,707 parts In-Stock

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4,707

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Digiode

USA . 2,443 parts In-Stock

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2,443

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Rebound Electronics

UK . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$0.090

100+ parts

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292

$0.090

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Vigor

Singapore . 715 parts In-Stock

1+ parts

$0.320

100+ parts

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715

$0.320

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Component Stockers USA

USA . 2 parts In-Stock

1+ parts

$0.380

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2

$0.380

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$29.305

100+ parts

$26.668

1k+ parts

$24.030

10k+ parts

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2,000

$29.305

$26.668

$24.030

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Kulean Microsystems

USA . 7,997 parts In-Stock

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SupplyDigital Components

Austria . 5,138 parts In-Stock

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TANS Electronics

Latvia . 4,627 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 2,188 parts In-Stock

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Assy Fe

Spain . 2,188 parts In-Stock

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Corphita

USA . 1,223 parts In-Stock

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UHIMA Technologies

Türkiye . 955 parts In-Stock

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Problanco Electronics

Mexico . 505 parts In-Stock

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Overview

Discover the ultimate solution for your bus driver and transceiver needs with the NLV27WZ126USG by Onsemi. Crafted with high-quality materials and cutting-edge technology, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this device provides seamless connectivity and efficiency. Elevate your projects with the value and benefits that only Onsemi can deliver. Choose the NLV27WZ126USG for unmatched quality and innovation in bus drivers and transceivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to wear and tear.

Propagation Delay At Nominal Supply: 4.8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, streamlining the design and saving costs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and performance in automotive applications, making this product a dependable choice for vehicle systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components and systems more seamless.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures optimal performance and stability of the driver/transceiver when connected to external devices.

Power Supplies (V): 3.3

Ability to support lower power supplies like 3.3V allows for compatibility with various systems and power sources.

No. of Terminals: 8

Having a sufficient number of terminals facilitates easy connections and integration within the circuit or system.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile and shrink pitch saves space on the PCB and enables dense layouts in designs.

Technical Specifications

Bus Driver & Transceivers NLV27WZ126USG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Family:

27WZ

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NLV27WZ126USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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