Loading...

NLV27WZ125USG

Onsemi

NLV27WZ125USG by Onsemi

NLV27WZ125USG by Onsemi is a Bus Driver & Transceiver with 2 functions, AEC-Q100 screening, and 3-STATE output. It operates at -55 to 125 °C, has a 32A I (ol), and 13ns propagation delay. Ideal for automotive applications requiring bidirectional control with a supply voltage range of 1.65V to 5.5V.

Median Price

$0.910

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 347 parts In-Stock

1+ parts

$0.910

100+ parts

$0.570

1k+ parts

$0.351

10k+ parts

$0.315

347

$0.910

$0.570

$0.351

$0.315

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,689 parts In-Stock

1+ parts

$0.864

100+ parts

-

1k+ parts

-

10k+ parts

-

1,689

$0.864

-

-

-

Vyrian

USA . 6,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,296

-

-

-

-

Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 978 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

-

10k+ parts

-

978

$0.350

-

-

-

Corphita

USA . 196 parts In-Stock

1+ parts

$0.819

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$0.819

-

-

-

Corohmni

South Africa . 212 parts In-Stock

1+ parts

$0.910

100+ parts

-

1k+ parts

-

10k+ parts

-

212

$0.910

-

-

-

Microchip USA

USA . 3,592 parts In-Stock

1+ parts

$6.175

100+ parts

-

1k+ parts

-

10k+ parts

-

3,592

$6.175

-

-

-

Infinite Electronics LLP (Excess)

. 9,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,001

-

-

-

-

Kulean Microsystems

USA . 8,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,366

-

-

-

-

SupplyDigital Components

Austria . 6,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,176

-

-

-

-

Problanco Electronics

Mexico . 3,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,797

-

-

-

-

TANS Electronics

Latvia . 1,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,037

-

-

-

-

UHIMA Technologies

Türkiye . 770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

770

-

-

-

-

Overview

Enhance your electronic designs with the NLV27WZ125USG by Onsemi, a high-quality bus driver & transceiver that delivers exceptional performance and reliability. Manufactured by Onsemi, a trusted industry leader known for cutting-edge technology, this product offers a wide range of applications and benefits. With a nominal supply voltage of 2.3V, a propagation delay of 13ns, and a maximum I (ol) of 32 Amp, this component ensures seamless operation in various devices. Upgrade your projects today with the NLV27WZ125USG and experience superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer product lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the bus driver & transceiver onto PCBs, saving time and reducing production costs.

No. of Functions: 2

Having 2 functions in one device increases the versatility and functionality of the bus driver & transceiver, making it a convenient choice for applications requiring multiple functions.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V ensures compatibility with a wide range of systems and applications, making this bus driver & transceiver suitable for various electronics projects.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this bus driver & transceiver can function reliably in demanding environments without risk of overheating or damage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable data transmission for the bus driver & transceiver.

Technical Specifications

Bus Driver & Transceivers NLV27WZ125USG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NLV27WZ125USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1