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NLSV2T244DMR2G

Onsemi

NLSV2T244DMR2G by Onsemi

NLSV2T244DMR2G by Onsemi is a small outline, thin profile interface IC with 8 terminals. It operates b/w -40 to 85 °C and has a supply voltage range of 0.9-4.5 V. Ideal for industrial applications requiring an interface circuit in a compact square package.

Median Price

$2.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 73 parts In-Stock

1+ parts

$2.230

100+ parts

$1.509

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73

$2.230

$1.509

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Distributors (In-Stock)

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Digiode

USA . 1,836 parts In-Stock

1+ parts

$2.356

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1,836

$2.356

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Vyrian

USA . 1,535 parts In-Stock

1+ parts

$2.480

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1,535

$2.480

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Chip Stock

USA . 4,600 parts In-Stock

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4,600

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Prism Electronics

USA . 50 parts In-Stock

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50

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Contempo Components LLC

USA . 39 parts In-Stock

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39

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Distributors (Availability)

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Vigor

Singapore . 370 parts In-Stock

1+ parts

$1.650

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370

$1.650

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Corphita

USA . 2,351 parts In-Stock

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$2.232

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2,351

$2.232

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Corohmni

South Africa . 399 parts In-Stock

1+ parts

$2.480

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399

$2.480

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Perfect Parts

USA . 11,928 parts In-Stock

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11,928

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TANS Electronics

Latvia . 6,269 parts In-Stock

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6,269

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Problanco Electronics

Mexico . 4,779 parts In-Stock

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4,779

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iodParts Technologies Inc.

India . 4,354 parts In-Stock

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4,354

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 2,979 parts In-Stock

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2,979

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SupplyDigital Components

Austria . 2,783 parts In-Stock

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2,783

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UHIMA Technologies

Türkiye . 652 parts In-Stock

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652

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Microchip USA

USA . 224 parts In-Stock

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224

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Overview

Unlock the potential of your electronic devices with the NLSV2T244DMR2G by Onsemi. As a leading manufacturer in the industry, Onsemi consistently delivers high-quality products that exceed customer expectations. The NLSV2T244DMR2G falls into the category of Other Function Interface ICs, offering versatility for a wide range of applications. With a compact design and reliable performance, this interface circuit is perfect for industrial use, providing seamless connectivity and control. Trust Onsemi to provide innovative solutions that enhance the efficiency and functionality of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 4.5 V

Supports a maximum supply voltage of 4.5V, making it compatible with a wide range of systems.

Package Shape: SQUARE

Square package shape allows for easy integration into circuit designs and board layouts.

Power Supplies (V): 1/4.2

Supports multiple power supply options, offering flexibility in system design.

No. of Terminals: 8

8 terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style saves space on the circuit board and enhances overall system compactness.

Minimum Supply Voltage: 0.9 V

Supports a minimum supply voltage of 0.9V, ensuring compatibility with low-power systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance in various operating conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures from -40 °C to 85°C allows for use in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides corrosion resistance and ensures long-term connectivity.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and connection options.

Maximum Seated Height: 1.1 mm

Low seated height of 1.1mm helps in compact designs and stack-up of components.

Width: 3 mm

Narrow width of 3mm allows for space-efficient placement on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature of 260 °C ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering and connectivity during assembly.

Length: 3 mm

Compact length of 3mm helps in space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical stability and easy soldering during assembly.

Nominal Supply Voltage: 3.3V

Nominal supply voltage of 3.3V for standard operation in various systems.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for high-density packing on the circuit board.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit IC for seamless communication between different components in a system.

Technical Specifications

Other Function Interface ICs NLSV2T244DMR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/4.2

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NLSV2T244DMR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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