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NLAST44599DTR2

Onsemi

NLAST44599DTR2 by Onsemi

NLAST44599DTR2 by Onsemi is a CMOS DPDT switch with 2 functions, 16 terminals, and 93 dB isolation. Operating b/w -55 to 125 °C, it has a max Ron of 105 ohm and fast switching times. Ideal for military-grade applications requiring separate outputs in compact spaces.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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AZTECH Wire

Italy . 1,011 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

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Overview

Discover the cutting-edge NLAST44599DTR2 multiplexer and switch from Onsemi, a leading manufacturer known for top-quality components. Ideal for various applications, this versatile product offers customers unmatched value and benefits. With a compact design and superior performance, this small outline, thin profile device provides separate outputs with minimal on-state resistance and lightning-fast switching times. Ensure precise control and reliable operation with this military-grade solution that delivers exceptional off-state isolation and break-before-make functionality. Experience innovation at its finest with the NLAST44599DTR2 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and flexibility for the component to withstand various environmental conditions.

Surface Mount: YES

Surface mount capability makes it easier to integrate this component onto the PCB, saving space and simplifying the assembly process.

No. of Functions: 2

Having 2 functions allows for multiplexing or switching between two different signals or channels, increasing versatility.

Nominal Supply Voltage (Vsup): 2.5 V

Operating at a nominal supply voltage of 2.5V offers energy efficiency and compatibility with low voltage systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this component can perform reliably in challenging thermal environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it suitable for a wide range of applications.

Maximum On-state Resistance (Ron): 105 ohm

The low on-state resistance of 105 ohm ensures minimal signal loss and distortion during switching operations.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits and ensures seamless transition between different channels or signals.

Technical Specifications

Multiplexers & Switches NLAST44599DTR2 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Nominal Off-state Isolation:

93 dB

Maximum On-state Resistance (Ron):

105 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Maximum Switch-off Time:

12 ns

Maximum Switch-on Time:

35 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

NLAST44599DTR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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