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NLAS7222CMUTBG

Onsemi

NLAS7222CMUTBG by Onsemi

NLAS7222CMUTBG by Onsemi is a CMOS DPDT switch with 10 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.65-4.5V and offers separate outputs with on-state resistance of 10 ohm. Ideal for industrial applications requiring fast switching (30ns) and high isolation (22dB).

Median Price

$0.684

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,486 parts In-Stock

1+ parts

$0.748

100+ parts

$0.583

1k+ parts

$0.491

10k+ parts

-

1,486

$0.748

$0.583

$0.491

-

DigiKey

USA . 154 parts In-Stock

1+ parts

$1.220

100+ parts

$0.800

1k+ parts

$0.520

10k+ parts

-

154

$1.220

$0.800

$0.520

-

Rochester

USA . 2,126 parts In-Stock

1+ parts

-

100+ parts

$0.620

1k+ parts

$0.515

10k+ parts

$0.459

2,126

-

$0.620

$0.515

$0.459

Verical

USA . 1,486 parts In-Stock

1+ parts

-

100+ parts

$0.583

1k+ parts

$0.491

10k+ parts

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1,486

-

$0.583

$0.491

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 27,000 parts In-Stock

1+ parts

$0.344

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27,000

$0.344

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Digiode

USA . 1,185 parts In-Stock

1+ parts

$0.710

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1,185

$0.710

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Cyclops Electronics Ltd

UK . 12,000 parts In-Stock

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12,000

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Vyrian

USA . 7,052 parts In-Stock

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7,052

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Semtec, LLC

USA . 1,800 parts In-Stock

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1,800

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Prism Electronics

USA . 30 parts In-Stock

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30

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Bristol Electronics

USA . 25 parts In-Stock

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25

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Flex Direct, LLC

USA . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 224 parts In-Stock

1+ parts

$0.583

100+ parts

-

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224

$0.583

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Corphita

USA . 52 parts In-Stock

1+ parts

$0.673

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52

$0.673

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Kepictronics

USA . 66,584 parts In-Stock

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66,584

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Perfect Parts

USA . 23,355 parts In-Stock

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TANS Electronics

Latvia . 8,120 parts In-Stock

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Kulean Microsystems

USA . 7,338 parts In-Stock

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7,338

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Problanco Electronics

Mexico . 5,054 parts In-Stock

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5,054

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SupplyDigital Components

Austria . 1,348 parts In-Stock

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1,348

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Microchip USA

USA . 554 parts In-Stock

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554

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Futuretech Components

Singapore . 548 parts In-Stock

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548

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 411 parts In-Stock

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411

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Overview

Experience seamless switching capabilities with the NLAS7222CMUTBG by Onsemi. Crafted with precision and reliability in mind, this multiplexer offers unparalleled performance in a compact package. Perfect for a wide range of applications, including industrial settings, this product ensures smooth operation and optimal functionality. Trust in Onsemi's reputation for excellence and unlock the true potential of your projects with the NLAS7222CMUTBG.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient soldering onto a PCB, saving space and enabling mass production.

Nominal Supply Voltage (Vsup): 3.3 V

Works efficiently with a common voltage supply, making it compatible with various systems.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, increasing its versatility and applicability.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with a wide range of devices.

Maximum On-state Resistance (Ron): 10 ohm

Low on-state resistance ensures minimal power loss and efficient signal switching.

Technical Specifications

Multiplexers & Switches NLAS7222CMUTBG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N10

JESD-609 Code:

e4

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Nominal Off-state Isolation:

22 dB

Nominal On-state Resistance Match:

.85 ohm

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

20 ns

Maximum Switch-on Time:

30 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.4 mm

Trade Compliance

NLAS7222CMUTBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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