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NLAS5213BUSG

Onsemi

NLAS5213BUSG by Onsemi

NLAS5213BUSG by Onsemi is a dual-function SPST switch with 1.4 ohm Ron, 57 dB isolation, and 0.16 ohm resistance match. It operates at -40 to 85 °C, with Vsup ranging from 1.65V to 4.5V. Ideal for industrial applications requiring precise signal routing in compact spaces.

Median Price

$0.374

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,466 parts In-Stock

1+ parts

-

100+ parts

$0.409

1k+ parts

$0.340

10k+ parts

$0.303

35,466

-

$0.409

$0.340

$0.303

Farnell

UK . 35,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.339

35,466

-

-

-

$0.339

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 264 parts In-Stock

1+ parts

$0.319

100+ parts

-

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-

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264

$0.319

-

-

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Vyrian

USA . 1,983 parts In-Stock

1+ parts

$0.336

100+ parts

-

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-

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-

1,983

$0.336

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 273 parts In-Stock

1+ parts

$0.302

100+ parts

-

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273

$0.302

-

-

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Vigor

Singapore . 384 parts In-Stock

1+ parts

$0.320

100+ parts

-

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-

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384

$0.320

-

-

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Corohmni

South Africa . 123 parts In-Stock

1+ parts

$0.336

100+ parts

-

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123

$0.336

-

-

-

Component Stockers USA

USA . 34,672 parts In-Stock

1+ parts

$0.350

100+ parts

$0.330

1k+ parts

$0.290

10k+ parts

$0.290

34,672

$0.350

$0.330

$0.290

$0.290

AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$16.060

100+ parts

-

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365

$16.060

-

-

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Continental Prestige Electronics

USA . 35,466 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.288

10k+ parts

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35,466

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-

$0.288

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Kulean Microsystems

USA . 7,493 parts In-Stock

1+ parts

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7,493

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Problanco Electronics

Mexico . 6,766 parts In-Stock

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6,766

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SupplyDigital Components

Austria . 2,116 parts In-Stock

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2,116

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TANS Electronics

Latvia . 681 parts In-Stock

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681

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UHIMA Technologies

Türkiye . 678 parts In-Stock

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678

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Microchip USA

USA . 381 parts In-Stock

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381

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Kepictronics

USA . 180 parts In-Stock

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180

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Overview

Discover the NLAS5213BUSG by Onsemi, a high-quality multiplexer & switch that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its small outline and very thin profile, this switch is ideal for industrial use. Experience seamless switching with a maximum on-state resistance of only 1.4 ohm. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Unlock new possibilities with the NLAS5213BUSG and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount YES

Surface mount capability allows for easy and convenient installation on PCBs.

No. of Functions 2

Having 2 functions in one device provides versatility and flexibility in circuit design.

Nominal Supply Voltage (Vsup) 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard electronic systems.

Maximum Operating Temperature 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions.

Terminal Finish TIN

TIN terminal finish enhances conductivity and corrosion resistance for better performance.

Width (mm) 2 mm

Compact width of 2mm enables space-saving design and integration in compact electronic devices.

Minimum Supply Voltage (Vsup) 1.65 V

Low minimum supply voltage of 1.65V ensures energy efficiency and compatibility with low-power applications.

Maximum Seated Height 0.9 mm

Low maximum seated height of 0.9mm allows for slim and compact product design.

No. of Channels 2

2 channels provide the ability to switch between different signals or inputs efficiently.

Technical Specifications

Multiplexers & Switches NLAS5213BUSG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

57 dB

Nominal On-state Resistance Match:

.16 ohm

Maximum On-state Resistance (Ron):

1.4 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

NLAS5213BUSG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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