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NLAS4052QSR

Onsemi

NLAS4052QSR by Onsemi

NLAS4052QSR by Onsemi is a CMOS differential multiplexer with 4 channels. It operates at temperatures from -55 to 125 °C and has a max on-state resistance of 37 ohm. With a small outline package, it's ideal for military-grade applications requiring high isolation and low signal current.

Median Price

$0.267

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,587 parts In-Stock

1+ parts

-

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$0.277

1k+ parts

$0.230

10k+ parts

$0.205

6,587

-

$0.277

$0.230

$0.205

Verical

USA . 5,000 parts In-Stock

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$0.257

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$0.257

Distributors (In-Stock)

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Digiode

USA . 462 parts In-Stock

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$0.217

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462

$0.217

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Vyrian

USA . 4,383 parts In-Stock

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4,383

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Distributors (Availability)

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Corphita

USA . 698 parts In-Stock

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$0.205

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698

$0.205

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Vigor

Singapore . 657 parts In-Stock

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$0.220

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657

$0.220

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Corohmni

South Africa . 387 parts In-Stock

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$0.228

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387

$0.228

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AZTECH Wire

Italy . 196 parts In-Stock

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$12.160

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196

$12.160

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Problanco Electronics

Mexico . 7,092 parts In-Stock

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Continental Prestige Electronics

USA . 6,586 parts In-Stock

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$0.199

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Kulean Microsystems

USA . 2,204 parts In-Stock

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TANS Electronics

Latvia . 2,152 parts In-Stock

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SupplyDigital Components

Austria . 1,779 parts In-Stock

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1,779

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UHIMA Technologies

Türkiye . 498 parts In-Stock

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498

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Microchip USA

USA . 196 parts In-Stock

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Overview

Discover the innovative NLAS4052QSR by Onsemi, a top-tier manufacturer known for delivering high-quality multiplexers & switches. Ideal for various applications, this product offers unparalleled value and benefits to customers seeking reliable performance and efficiency. With its advanced technology and precise design, the NLAS4052QSR ensures seamless operation and optimal results. Upgrade your projects with this exceptional component and experience the advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer.

Nominal Supply Voltage (Vsup): 3 V

Optimal supply voltage for efficient operation of the multiplexer.

No. of Terminals: 16

Allows for connectivity to multiple input and output devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Technical Specifications

Multiplexers & Switches NLAS4052QSR attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

4.9 mm

Maximum Negative Supply Voltage (Vsup):

-5.5 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-3 V

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

93 dB

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

37 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

-3.3/GND,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.05 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

28 ns

Maximum Switch-on Time:

28 ns

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width (mm):

3.9116 mm

Trade Compliance

NLAS4052QSR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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