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NLAS324US

Onsemi

NLAS324US by Onsemi

NLAS324US by Onsemi is a CMOS SPST switch with 2 functions, operating at -55 to 125 °C. It has a max on-state resistance of 55 ohm and offers separate output at a nominal voltage of 3 V. Ideal for military-grade applications requiring small outline, thin profile switches with high isolation levels.

Median Price

$2.230

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,882 parts In-Stock

1+ parts

$2.230

100+ parts

$0.963

1k+ parts

$0.834

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2,882

$2.230

$0.963

$0.834

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Distributors (In-Stock)

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Digiode

USA . 629 parts In-Stock

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$2.118

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629

$2.118

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Electronics Depot

USA . 3,000 parts In-Stock

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Vyrian

USA . 2,922 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,362 parts In-Stock

1+ parts

$2.007

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2,362

$2.007

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Corohmni

South Africa . 94 parts In-Stock

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$2.230

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94

$2.230

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AZTECH Wire

Italy . 674 parts In-Stock

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$12.160

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674

$12.160

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Perfect Parts

USA . 16,404 parts In-Stock

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Kulean Microsystems

USA . 6,808 parts In-Stock

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TANS Electronics

Latvia . 3,432 parts In-Stock

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GreenTree Electronics

Israel . 2,882 parts In-Stock

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Problanco Electronics

Mexico . 1,956 parts In-Stock

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SupplyDigital Components

Austria . 1,425 parts In-Stock

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Vigor

Singapore . 699 parts In-Stock

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699

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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Microchip USA

USA . 173 parts In-Stock

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Overview

Looking for a reliable and versatile multiplexer switch? Look no further than the NLAS324US by Onsemi. With a quality package body material of PLASTIC/EPOXY and small outline design, this switch offers two functions to cater to your needs. From military-grade applications to consumer electronics, this switch delivers top-notch performance with a wide operating temperature range and quick switching times. Trust Onsemi's expertise and choose the NLAS324US for seamless integration and superior functionality. Elevate your projects with this high-quality switch today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the multiplexer, ensuring long-lasting performance.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3 V

Operates at a stable voltage of 3V, ensuring reliable performance within specified parameters.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the multiplexer to function effectively in various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish on terminals enhances conductivity and ensures secure connections for efficient signal transmission.

Technology: CMOS

CMOS technology offers low power consumption and high-speed switching capabilities, making the multiplexer efficient and reliable.

Technical Specifications

Multiplexers & Switches NLAS324US attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

2.3 mm

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

93 dB

Maximum On-state Resistance (Ron):

55 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

16 ns

Maximum Switch-on Time:

12 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

NLAS324US Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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