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NLAS3158MNR2G

Onsemi

NLAS3158MNR2G by Onsemi

NLAS3158MNR2G by Onsemi is a CMOS SPDT switch with 2 functions, 12 terminals, and 24 ohm max on-state resistance. It operates b/w -55 to 125 °C and has a supply voltage range of 1.65V to 5.5V. Ideal for military-grade applications requiring fast switching times and high isolation levels.

Median Price

$0.502

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2,880 parts In-Stock

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$0.610

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$0.394

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$0.292

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$0.610

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Verical

USA . 2,880 parts In-Stock

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$0.394

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$0.292

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$0.394

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Flip Electronics

USA . 3,000 parts In-Stock

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$0.186

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$0.186

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Digiode

USA . 698 parts In-Stock

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$0.579

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Chip Stock

USA . 11,086 parts In-Stock

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Vyrian

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Sensible Micro Corp

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Infinite Electronics LLP

India . 2,989 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,281 parts In-Stock

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Ampacity Inc.

Singapore . 2,397 parts In-Stock

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$0.335

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Corohmni

South Africa . 334 parts In-Stock

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$0.394

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Corphita

USA . 769 parts In-Stock

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$0.549

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769

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AZTECH Wire

Italy . 581 parts In-Stock

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$15.030

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Perfect Parts

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Kepictronics

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GreenTree Electronics

Israel . 11,842 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 7,330 parts In-Stock

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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Kulean Microsystems

USA . 4,689 parts In-Stock

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Problanco Electronics

Mexico . 2,533 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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TANS Electronics

Latvia . 1,384 parts In-Stock

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Assy Fe

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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Microchip USA

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Formix International (Excess)

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Overview

Discover the NLAS3158MNR2G by Onsemi, a top-quality multiplexer & switch designed to elevate your electronic projects. With Onsemi's reputation for excellence in manufacturing, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this versatile component delivers exceptional value with its seamless operation and precision control. Experience the benefits of advanced technology without sacrificing quality. Elevate your projects with the NLAS3158MNR2G today!

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted onto a PCB, making it convenient for assembly and reducing production time.

No. of Functions: 2

Having 2 functions allows for more flexibility and functionality in the circuit or system where this multiplexer or switch is used.

Nominal Supply Voltage (Vsup): 2.3 V

The nominal supply voltage of 2.3V ensures compatibility with a wide range of systems and devices, making it versatile.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product is suitable for use in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Multiplexers & Switches NLAS3158MNR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDSO-N12

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

12

Nominal Off-state Isolation:

55 dB

Nominal On-state Resistance Match:

.5 ohm

Maximum On-state Resistance (Ron):

24 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC12,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

12.5 ns

Maximum Switch-on Time:

23 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1 mm

Trade Compliance

NLAS3158MNR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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