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NLAS2066UST3

Onsemi

NLAS2066UST3 by Onsemi

NLAS2066UST3 by Onsemi is a CMOS SPST switch with 2 functions, 8 terminals, and 1.65V min supply voltage. It operates b/w -55 to 125 °C and offers separate output at 50 ohm resistance. Ideal for military-grade applications requiring fast switching times and high isolation levels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,584 parts In-Stock

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Digiode

USA . 1,971 parts In-Stock

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AZTECH Wire

Italy . 505 parts In-Stock

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$19.120

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SupplyDigital Components

Austria . 8,085 parts In-Stock

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Kulean Microsystems

USA . 7,067 parts In-Stock

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Problanco Electronics

Mexico . 2,614 parts In-Stock

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TANS Electronics

Latvia . 2,283 parts In-Stock

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Corphita

USA . 1,877 parts In-Stock

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Corohmni

South Africa . 463 parts In-Stock

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UHIMA Technologies

Türkiye . 315 parts In-Stock

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Vigor

Singapore . 309 parts In-Stock

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Microchip USA

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Overview

Discover the unparalleled performance and reliability of the NLAS2066UST3 by Onsemi. As a leading manufacturer in the industry, Onsemi's Multiplexers & Switches category offers cutting-edge solutions for a wide range of applications. With a focus on quality and innovation, this product delivers exceptional value to customers looking for seamless functionality and precise control. Experience the benefits of advanced technology and superior design with the NLAS2066UST3, setting new standards in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for portable and rugged applications.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs, making it efficient in circuit design.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, simplifying the overall system design.

Nominal Supply Voltage (Vsup): 2.3 V

The nominal supply voltage of 2.3V ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable operation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable.

Technical Specifications

Multiplexers & Switches NLAS2066UST3 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

73 dB

Nominal On-state Resistance Match:

1.3 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

10 ns

Maximum Switch-on Time:

9 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

NLAS2066UST3 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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